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EDITOR'S PICKS |
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UPCOMING EVENTS |
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Dear Subscriber,
In case you haven't already heard about the 3-D All Silicon System Module (3DASSM) consortium, an academia/industry effort led by Georgia Tech, Fraunhofer IZM and KAIST, I'll just give it a quick mention here, because it's launching in October. It's important to point out that it's not just about through-silicon vias (TSVs), which will be covered, but goes way beyond. For more details, click the link under Editor's Picks. And to keep up with all the latest packaging news, check our Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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| Thru-Silicon-Via (TSV) Foundry Services |
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3-D Startup Is Ahead of Its Time
Phil Garrou, Editorial Advisor -- Semiconductor International, 10/1/2008
As the 3-D integration infrastructure evolves, it is becoming clear that low-cost, reliable bonding technology is required for 3-D IC integration to become mainstream. Without question, the industry is looking for solutions with lower cost of ownership (CoO). Ziptronix CEO Dan Donabedian thinks his company's time has come. More |
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Tessera Names Michael Anthofer as Executive VP and CFO
Business Wire, 9/29/2008
Tessera Technologies Inc. announced that Michael Anthofer has been named executive vice president and CFO. Anthofer will report to CEO and President Henry R. Nothhaft, and will be responsible for the company's finance, accounting, strategic planning and investor relations. More |
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DuPont Adds to Its WLP Offerings
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 9/29/2008
To meet growing demand for new materials for 3-D packaging and through-silicon vias, DuPont Electronic Technologies is expanding its material offerings. More |
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Kulicke & Soffa Completes Divesture of Wire Business Unit
Business Wire, 9/29/2008
Kulicke & Soffa Industries Inc. has completed the previously announced sale of its wire business unit to W.C. Heraeus GmbH, a precious metals and technology group. More |
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Quik-Pak Acquires Business Units of Aguila Technologies
PR Newswire, 9/25/2008
Quik-Pak, a division of Delphon Industries, announced the acquisition of Aguila Technologies' flip-chip assembly, detector array processing, and laser micromachining business units. More |
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MEMS Price to Fall as Production Rises
Charles J. Murray, Senior Technical Editor, Electronics -- Design News, 9/22/2008
A new breed of automotive applications may be on the horizon for MEMS sensors. Moreover, many engineers believe the MEMS sensor applications could be integrated into fewer modules, thus driving costs down for manufacturers. More |
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Aehr Test Systems Reports 27% Increase in Net Sales for Q1 2009
PR Newswire, 9/25/2008
Aehr Test Systems, which supplies semiconductor test and burn-in equipment, announced financial results for the first quarter of fiscal 2009 ended Aug. 31, 2008. Net sales were $9.7M in the first quarter of fiscal 2009, an increase of 27% from $7.7M in the first quarter of fiscal 2008. More |
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ChipMOS Updates Q3 2008 Guidance
PR Newswire, 9/26/2008
ChipMOS has revised its guidance for the third quarter of 2008 to reflect the lower than expected demand in DRAM business due to output decrease from customers and inventory adjustment in the pipeline. The company had originally expected Q3 revenue to be flat to down 6% compared with the Q2 revenue of NT$4.82 billion ($158.7M), with 2.5-5.5% of gross margin on a consolidated basis for the third quarter of 2008. More |
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| SEMICON Europa 2008 – Advanced Innovations |
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Georgia Tech, Partners Launch 3-D Consortium
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 9/30/2008
Georgia Institute of Technology's (Atlanta) Packaging Research Center (PRC), along with academia partners at Fraunhofer IZM (Berlin) and Korea's Advanced Institute of Science and Technology (Daedeok Science Town, Korea), will officially launch the 3-D All Silicon System Module (3DASSM) consortium in October. More |
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Ambitious Plan for N.Y. Packaging Center
David Lammers, News Editor -- Semiconductor International, 9/23/2008
A packaging R&D center supported by IBM and New York officials is likely to begin operations soon, even before funding is finalized and construction of the building can begin. Alain Kaloyeros, CEO of the College of Nanoscale Science and Engineering (CNSE) at the University at Albany, said the center will attract a variety of packaging infrastructure companies to the region. More |
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Advertisement |
| Online Buyer’s Guide: Your Search Starts and Ends Here |
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Search Semiconductor International’s Online Buyer’s Guide for products, services and vendors, or browse through product categories. It's the comprehensive buyers guide for the global semiconductor manufacturing industry. To see the latest company listings and product information, visit:
buyersguide.semiconductor.net
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Fluid Jetting Valve
The DispenseJet DJ-9500 is a fluid jetting valve for high-speed underfill applications and jetting silicone for LEDs. The flexible pneumatic design can jet a wide variety of fluid types. More |
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QFN Sockets
The NP506 socket series has ultrafine pitches of 0.4 and 0.5 mm, as well as 28-56 pads, in an open-top design for the test and burn-in of small IC packages. The active centering of the IC module enables balancing of larger module tolerances for sawed and punched QFNs. More |
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| Check Out SI’s Technology Library |
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Discover 100s of pages of technical content from key suppliers in the industry.
- White Papers
- Research
- Spec Sheets
- Product Information
- And much more
www.semiconductor.net/techlibrary |
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International Wafer-Level Packaging Conference
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Advanced Technology Workshop on Thermal Management
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IMAPS 2008
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