|
IN THIS EDITION |
|
|
|
NEWS |
|
| |
|
|
|
EDITOR'S PICKS |
|
| |
|
|
|
PRODUCTS |
|
| |
|
|
|
UPCOMING EVENTS |
|
|
|
|
| |
|
|
|
|
Dear Subscriber,
This week, it's been hard thinking that anything like business as usual can go on in the semiconductor industry, or any industry, given the financial crisis that apparently exists in the United States and will rapidly spread if it continues without resolution. We have a couple of interesting blogs this month in our editor's picks -- one from Dave Lammers, our news editor, who recently visited Albany and talks about the details of the funding for that institution and how it compares to the deficit that New York state is running up. Suzanne Defree, one of the editors writing for sister publication EDN, compares the financial turmoil to the tech boom/bust of 2000/2001, but readers remind her of the stark differences. Remember, you can always catch up on news at our Wafer
Processing Technology Channel:
www.semiconductor.net/wafer
Laura Peters, Editor-in-Chief
lpeters@reedbusiness.com |
|
|
Advertisement |
| Cu Post-CMP Cleaning: A Neutral pH Cleaning Solution |
|
DuPont EKC Technology's EKC PCMP5510 for 45nm and beyond: a
single chemistry for all cleaning modules; low defectivity;
flexible dilution to meet low CoO targets; and neutral pH
technology. Use with acidic or basic barrier slurries;
compatible with sensitive low-k films; excellent corrosion
resistance; manufacturing proven.
Click here!
| |
|
|
|
|
|
|
|
|
|
|
NEC Electronics Joins Fishkill Alliance
David Lammers, News Editor -- Semiconductor International, 9/11/2008
NEC Electronics has joined the IBM-led Fishkill Alliance, with a goal of implementing NEC's automotive microcontrollers and other products on the high-k/metal gate process at 32 nm design rules. More |
|
|
|
|
Renesas Selling German Fab to Foundry Services Start-Up
Ann Steffora Mutschler, Senior Editor -- Electronic News, 9/24/2008
Negotiations with the new potential shareholders are proceeding, and the deal is expected to close by the end of this year. More |
|
|
|
|
Rohm and Haas Promotes Grooved CMP Pads
Business Wire, 9/10/2008
Rohm and Haas Electronic Materials, CMP Technologies, announced that its novel defect reduction and slurry reduction groove designs for CMP pads are quickly gaining market acceptance across the globe. More |
|
|
|
|
Praxair Raises Prices for Tantalum Products
Business Wire, 9/10/2008
Praxair Electronics, a division of Praxair Inc., announced a worldwide price increase of 15% on tantalum products, effective immediately or as customer contracts otherwise permit. More |
|
|
|
|
Novellus's Rick Hill: Is the Move to the 450 mm Wafer Size a Viable One?
Ann Steffora Mutschler, Senior Editor -- Electronic Business, 9/16/2008
Novellus chairman and CEO Richard S. Hill discusses the industry's move to the 450 mm wafer size, the dynamics that come into play, along with the biggest challenges for the company as well as the industry going forward. More |
|
|
|
|
Management Shuffle Continues at Freescale
Suzanne Deffree, Managing Editor, News -- Electronic News, 9/24/2008
Lisa Su slides from Freescale's CTO seat to VP, networking and multimedia, as Freescale continues to reorganize its management with CEO Rich Beyer at the helm. More |
|
|
|
|
SAFC Hitech Moves Phase-Change Memory Closer to Commercial Use
Ann Steffora Mutschler, Senior Editor -- Electronic News, 9/4/2008
The company reported that extensive development work has been conducted with both the precursors and the use of conventional metal-organic chemical vapor deposition (MOCVD) techniques to deposit them, resulting in the successful deposition of device-quality GST precursors, which are believed to represent a major step toward achieving a commercially viable solution to address the aggressive memory device scaling issues faced by the semiconductor industry to keep pace with Moore's Law. More |
|
|
Advertisement |
| Processing and Technology Courses from Semitracks Inc. |
|
Wafer Fab Processing 10/27-30
CMOS Process Integration 10/27-28
BiCMOS Process Integration 10/29-30
Interconnect Process Integration 10/31
Our industry experts cover processing and
integration challenges with CMOS, BiCMOS and
BEOL interconnects.
View more!
|
|
|
|
|
|
|
|
|
|
|
|
|
Wall Street's Fallout on Albany NanoTech
David Lammers, News Editor -- Semiconductor International, 9/24/2008
The Empire State has invested $900M in the Albany NanoTech research complex, while IBM and other private companies have invested $3.5B in Albany. The result is a thriving R&D community, a technically vibrant IBM, and a public-private partnership that is likely to weather the current economic downturn. Money well spent. More |
|
|
|
|
Wall Street's Mess: Tech Bubble 2.0?
Suzanne Deffree, Managing Editor, News -- EDN, 9/23/2008
Easy money. Easy credit. Greed. No real financial stability. Unreal expectations. Is that a description of the current Wall Street crisis or the tech bubble boom and subsequent bust of the late 1990s? The two are not identical, but the parallels between them are undeniable and some economists are arguing that the tech bubble brought us to our current financial disarray. More |
|
|
|
|
Webcast: Evolving CMP for Scaling
Moderated by Aaron Hand, Executive Editor, Electronic Media -- 9/16/2008
Shrinking critical dimensions with correspondingly thinner metal layers and shorter stack heights have been alerting all sectors to rethink traditional chemical mechanical planarization (CMP) chemistries and processes. Panelists for this webcast, now available on demand, discussed the demands for low-damage processes and excellent uniformity, as well as new ways to address those challenges, particularly in copper metallization and barrier steps for interconnects. More |
|
|
Advertisement |
| Oct. 21 Webcast: Metrology Gears for the Nanotech Age |
|
The resolution, accuracy and capability of many metrology
technologies are reaching their limits, and may not meet
all the needs of nanotech manufacturing processes. In this
webcast, possible metrology technology options will be
discussed by experts in the field.
Register now!
Sponsored by: Jordan Valley
|
|
|
|
|
|
|
|
|
|
|
|
Gap Fill System
The Producer eHARP system delivers void-free films to fill <30 nm, >12:1 aspect ratio features for planar and 3-D device structures. The system requires no protective liners or capping layers, and easily integrates with conventional CMP processes. Applied Materials Inc., Santa Clara, Calif.More |
|
|
|
|
Electrochemical Process
AquiVia was designed to produce conformal, uniform insulation and barrier layers inside a TSV with aspect ratios beyond 10:1. Alchimer SA, Santa Barbara, Calif.More |
|
|
|
|
Line Heater System
The Relialine 170 heating system improves temperature uniformity by precisely heating individual elbow, tee and VCR fittings. The temperature compensation feature allows the system to increase wattage in cooler regions and decrease the power in warmer zones. Watlow, St. Louis.More |
|
|
|
|
|
|
Oct. 20-23, 2008: ISMI Symposium on Manufacturing Effectiveness
|
|
Oct. 27-28, 2008: CMOS Process Integration Seminar
|
|
|
|
|
Advertisement
 |
