| Dear Subscriber,
The big news this week came from Sematech's Lithography Division, which finally named a new director and associate director after a few months of question about who would replace Michael Lercel after his named predecessor went elsewhere. Meanwhile, the nanoimprint folks (who snatched up Ben Eynon, by the way) are making headlines with advances in patterned media and LEDs. Keep up with all the latest developments at our Lithography Technology Channel:
www.semiconductor.net/lithography
Aaron Hand, Executive Editor, Electronic Media
ahand@reedbusiness.com |
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Sematech Names Leaders of Lithography Division
Aaron Hand, Executive Editor, Electronic Media -- Semiconductor International, 9/9/2008
After some four months in limbo, Sematech announced that it has named the new director and associate director of its lithography division -- Bryan J. Rice and Stefan Wurm, respectively. More |
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German Ministry Funds Mask Project
Staff -- Semiconductor International, 9/4/2008
The German government will fund a mask development project aimed at 32/22 nm masks, with participation by the Advanced Mask Technology Center, Vistec Semiconductor, and the German Metrology Institute. The goal is to develop mask technologies for 32 nm memories and 22 nm microprocessors. More |
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API Nanotronics to Develop Proprietary Deep UV Polarizers
Market News Publishing, 9/9/2008
API Nanotronics Corp. announced it concluded an agreement with a leading semiconductor capital equipment company to develop proprietary high-performance DUV polarizers for next-generation lithography equipment. More |
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Grant Willson Receives Presidential Medal of Honor
Targeted News Service, 8/27/2008
Two chemical engineering professors from The University of Texas at Austin have been recognized by President George W. Bush as 2007 National Medal of Technology and Innovation laureates, the nation's highest honor for technological achievement. More |
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Obducat Garners Nanoimprint Orders From LED Maker Luxtaltek
Staff -- Semiconductor International, 8/21/2008
Sweden's Obducat AB said it has received an order for two of its NIL systems from Luxtaltek Corp., a maker of LEDs and GaN wafers. Obducat CEO Patrik Lundström said the LED sector could generate $150M in NIL orders over the next five years. More |
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Photronics Appoints Peter S. Kirlin Senior VP
Business Wire, 8/21/2008
Photronics Inc. said Peter S. Kirlin has been named senior vice president - U.S. and Europe. In this newly created position, Kirlin has assumed responsibility for the mainstream mask business in both the United States and Europe, and will also support both corporate business development and strategic planning. More |
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Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media
David Lammers, News Editor -- Semiconductor International, 8/19/2008
Researchers working at Hitachi Global Storage Technologies and the University of Wisconsin have applied a self-assembly approach that would sharply reduce the time required to write NIL templates. The HDD industry is moving to bit-patterned media, and the self-assembly approach would sharply reduce the e-beam writing time for templates. More |
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Ultratech Management Sees Bright Outlook
James Detar -- Investor's Business Daily, 8/14/2008
Sales growth at Ultratech, a small chip equipment maker, is running ahead of a lot of its larger peers after it lost money from 2005 to 2007. More |
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Mask-Level Measurements Predict Imaging Performance for Flash Designs
E. van Setten, O. Wismans, K. Grim and J. Finders, ASML Netherlands BV, Veldhoven, Netherlands; M. Dusa, ASML TDC, Santa Clara, Calif., www.asml.com; R. Birkner, R. Richter and T. Scherübl, Carl Zeiss SMS GmbH, Jena, Germany -- Semiconductor International, 9/1/2008
Flash memory is accelerating the push for continued scaling, and hyper-NA immersion lithography has brought 45 nm and below imaging within reach. Several mask parameters are important for imaging performance, and mask-level aerial imaging is useful for characterizing that performance before exposure. More |
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Self-Aligned Double Patterning Gains NAND Flash Favor
Chris Bencher, Applied Materials Inc., Santa Clara, Calif. -- Semiconductor International, 9/1/2008
Whether you call it frequency doubling, pitch reduction, spacer mask patterning or SADP, sidewall spacer transfer patterning techniques are being adopted at an accelerating rate by NAND flash device makers. This article describes the generic process flows and demonstrated capabilities of the technique. More |
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Looking for Truth in Conferences
Aaron Hand, Executive Editor, Electronic Media -- Semiconductor International, 9/1/2008
Autumn is a busy conference time for the lithography world -- one piled on top of another as we make our way through September and October. There are certainly a lot of challenges to be overcome within the lithography arena, but I've often wondered how it is that lithographers have any time to actually do the research that they seem to be sharing so often during the year. More |
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Resist Strip/Residue Clean System
The Enviro Optima resist strip and residue clean technology delivers a 400 wph throughput with a 300 mm footprint. Resist removal rate is >10 µm/min via a remote plasma source. ULVAC Technologies Inc., Methuen, Mass.
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E-Beam Resists
XR-1541 e-beam resists were designed to enable the development of next-generation direct-write lithography processing technology. The spin-on resists allow patterning with electron beams that can define features as small as 6 nm. Dow Corning Electronics, Silicon Lithography Solutions Group, Midland, Mich.
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Sept. 22-25, 2008: International Symposium on Immersion Lithography Extensions
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Sept. 28-Oct. 1, 2008 : International Symposium in EUV Lithography
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Oct. 6-10, 2008: SPIE Photomask
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