Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... August 28, 2008

STATS ChipPAC to Manufacture Infineon's First-Gen eWLB Products
STATS ChipPAC has signed on to provide manufacturing services for products using Infineon's first-generation embedded wafer-level ball grid array (eWLB) technology at its facility in Yishun, Singapore. eWLB is a fan-out wafer-level packaging technology that uses a combination of traditional front-end and back-end manufacturing techniques with parallel processing of all the chips on the wafer to provide a higher integration level.
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Siemens Reduction in Staff To Be Costly

Grant Willson Receives Presidential Medal of Honor

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Webcast: Can Copper Deposition Break the 32 nm Barrier?
It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this on demand webcast, a panel of industry experts discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY, Zsolt Tökei of IMEC, and Daniel Josell of NIST.
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Sponsored by: Jordan Valley

FEATURED BLOG...

Now Hear This! Labor Group Protests Nvidia
Suzanne Deffree, managing editor at Electronic News, reports about a series of protests against Nvidia organized by union activists from a group called Unite Here. The group protested Nvidia's handling of its recent graphics chip production problems. Deffree writes that the Unite Here group employed "tactics as flyering, light projections, and the distribution of potato chip bags with creative stickers that read 'Find the flawed chip' to draw attendees' attentions to Nvidia's recent product failures." The blog attracted a dozen comments by readers, many of them debating the value of unions in the 21st century.

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Sept. 16 Webcast: Evolving CMP for Scaling
In this webcast, panelists will discuss the demands for low-damage processes and excellent uniformity as well as new ways to address those challenges, particularly in copper metallization and barrier steps for interconnects. Panelists include: Mark Buehler of Intel Corp., Jan Vaes of IMEC, Reinhold Dauskardt of Stanford University, and Rajiv Singh of the University of Florida.
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Sponsored by: Levitronix and Jordan Valley

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