Semiconductor International : Wafer Processing Report
August 22, 2008
IN THIS EDITION
NEWS
 
» Japan June Chipmaking Gear Orders Fall for 15th Month
» Alchimer Claims 'Fully Wet' Via Solution
» IBM Alliance Builds 22 nm SRAM Cell
» Spansion Extends Flash Foundry Agreement With SMIC
» Rohm and Haas Expands in Taiwan
» Lam Research Posts 58% Drop in Quarterly Profit
» Axcelis Announces Financial Results for Second Quarter 2008
EDITOR'S PICKS
 
» Increasing Demands Require New Look at Wafer Cleans
» Resist Removal Walks a Tightrope
» Engineering Tops List of College Degrees Ranked by Salary
PRODUCTS
 
» High-Energy Ion Implanter
» Plasma Abatement System
» Dry Nitrogen Cabinet
UPCOMING EVENTS
 
Dear Subscriber,

Global economic conditions continue to affect the semiconductor industry, as evidenced by the latest order numbers from Japan's chipmakers, which were down in June for the 15th month in a row, as well as negative financial reports from Lam Research and Axcelis. This month, we have an interesting salary survey from PayScale, which sister publication, EDN, comments about, that shows engineering is as lucrative a field as it has ever been. For up-to-date news, remember to check out our Wafer Processing Technology Channel:

www.semiconductor.net/wafer

Laura Peters, Editor-in-Chief
lpeters@reedbusiness.com

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NEWS

Japan June Chipmaking Gear Orders Fall for 15th Month
Jiji Press Ticker Service, 8/19/2008

Orders for chipmaking equipment received in Japan in June by domestic and foreign manufacturers fell 23.9% from a year earlier to 74.8 billion yen, extending the losing streak to a 15th month, the Semiconductor Equipment Association of Japan (SEAJ) said. The drop came as major Japanese semiconductor makers withheld spending in facilities and equipment given uncertainties over the future course of the overall economy, association officials said. More

Alchimer Claims 'Fully Wet' Via Solution
David Lammers, News Editor — Semiconductor International, 8/1/2008

Alchimer SA said experiments have shown that its "electrografting" technology can handle deposition of the insulation, barrier and seed layers in through-silicon vias (TSVs). The privately held company also said its technology is being adopted by the CMOS image sensor vendors. More

IBM Alliance Builds 22 nm SRAM Cell
Staff — Semiconductor International, 8/18/2008

IBM and its semiconductor research partners said they have built a working 22 nm SRAM cell with an area of 0.1 um2. The partners plan to describe the SRAM cell in more detail at IEDM, planned for Dec. 15-17 in San Francisco. More

Spansion Extends Flash Foundry Agreement With SMIC
PR Newswire, 8/21/2008

Spansion Inc. announced that it has extended its current agreement with Semiconductor Manufacturing International Corp. (SMIC) for the production of 65 nm MirrorBit NOR to include the manufacture of 43 nm Spansion MirrorBit ORNAND Flash memory on 300 mm wafers. More

Rohm and Haas Expands in Taiwan
Asia Pulse, 7/29/2008

Rohm and Haas Electronic Materials, CMP Technologies, announced that it is increasing investments in its Asia-Pacific Pad Manufacturing Facility located in Hsinchu, Taiwan. The investment is aimed at accelerating the company's capacity expansion to meet the growing demand for CMP pads from semiconductor manufacturing customers in Asia. Fully operational and in production since March 2007, the Hsinchu plant has been qualified by major logic and memory semiconductor customers in the region. More

Lam Research Posts 58% Drop in Quarterly Profit
Benjamin Pimentel — MarketWatch, 7/29/2008

Lam Research Corp. reported a 58% drop in fiscal fourth-quarter profit as the company reeled from declines in chip-equipment spending. Lam reported a net income of $72.2M, or $0.57 cents a share, compared with a net income of $170.2M, or $1.28 a share, for the year-earlier period. Revenue was $566.2M, down from $678.5M. More

Axcelis Announces Financial Results for Second Quarter 2008
PrimeNewswire, 8/8/2008

Axcelis Technologies recently announced financial results for the second quarter ended June 30, 2008. The company reported second-quarter revenues of $76.9M, compared with $84.9M for the first quarter of 2008. Net loss for the second quarter was $19.4M, or $0.19 cents per share. More

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EDITOR'S PICKS

Increasing Demands Require New Look at Wafer Cleans
Aaron Hand, Executive Editor, Electronic Media — Semiconductor International, 8/1/2008

Smaller, more fragile structures, as well as a whole host of new materials, will require a new look at cleaning solutions, with more need to combine approaches — wet and dry, mechanical and chemical. More

Resist Removal Walks a Tightrope
Ruth DeJule, Contributing Editor — Semiconductor International, 8/1/2008

Between limiting damage to low-k materials and silicon removal at the gate, while definitely clearing away all photoresist and its residues, resist removal processes — wet and dry — continue to strive to maintain the right balance. More

Engineering Tops List of College Degrees Ranked by Salary
Suzanne Deffree, Managing Editor, News — EDN, 8/5/2008

According to a 2008 education and salary survey by PayScale Inc., a real-time profiling company that runs an ongoing salary survey and database of individual employee compensation profiles, engineering ranks as the top undergraduate degree by salary. Specifically, chemical, computer, electrical and aerospace engineering, respectively, are the top-paying careers based on an undergrad degree. More

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PRODUCTS

High-Energy Ion Implanter
Market Wire, 8/20/2008

The VIISta HE capitalizes on the company's patented True Zero beam angle control architecture. The VIISta HE ion implanter has been designed to meet strong customer demand for a precise single-wafer high-energy tool.
Varian Semiconductor Equipment Associates (VSEA), Gloucester, Mass.
More

Plasma Abatement System

Sirius 6000 is a system designed to address greenhouse gas abatement challenges presented by dielectric and polysilicon etch processes.
Edwards, Crawley, West Sussex, UK
More

Dry Nitrogen Cabinet

NitroPlex is a dry nitrogen cabinet with multiple storage chambers, each with a dedicated humidity monitor/control module. Quick-response sensors direct nitrogen to each chamber independently to maintain clean, dry conditions, minimizing moisture exposure even when an access door is open.
Terra Universal, Fullerton, Calif.
More

UPCOMING EVENTS

Sept. 21-24, 2008: Ultra-Clean Processing of Semiconductor Surfaces

Sept. 25-26, 2008: Manufacturing and Reliability Challenges for 3-D IC

Oct. 7-9, 2008: SEMICON Europa

Copyright 2008 Reed Business Information, a division of Reed Elsevier Inc. All Rights Reserved.
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