Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... August 19, 2008

Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media
Researchers working at Hitachi Global Storage Technologies and the University of Wisconsin-Madison have applied a self-assembly approach that would sharply reduce the time required to write nanoimprint lithography (NIL) templates. The hard disk drive (HDD) industry is moving to bit-patterned media, and the self-assembly approach would sharply reduce the electron-beam writing time for a 95 mm diameter template with terabit/in2 densities.
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 MORE NEWS...

China's Trina Solar Q2 Net Profit More Than Doubles

ASMI CFO Replaces CEO in Applied Talks

Inventory Days Lean, Component Makers Well-Positioned to Benefit

LDK Solar Contracts With Applied for Wafering Systems

Suntech Completes Purchase of Stake in Nitol Solar

iSuppli to NAND Market: Don't Count on Second-Half Revenue Growth

MORE >>

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Webcast: SIA Industry Forecast 2008-2011
Tune in to this mid-year on demand webcast for the latest SIA forecast of global semiconductor sales through 2011. SIA President George Scalise offers comments and analysis of what may lie ahead for the global chip industry.
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FEATURED PODCAST...

Movers & Shakers: Industry Concerns From IP Theft to EUV Lithography
Senior Editor Alexander E. Braun recently interviewed Bob Akins, co-founder and CEO of Cymer. Akins discusses his recent appointment as chairman of SEMI's International Board of Directors, and concerns about IP theft. He also looks ahead to the time when EUV lithography will come online.

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Webcast: Can Copper Deposition Break the 32 nm Barrier?
It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this on demand webcast, a panel of industry experts discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY, Zsolt Tökei of IMEC, and Daniel Josell of NIST.
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Sponsored by: Jordan Valley

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