Perspectives From the Leading Edge:
IITC on the 3-D Integration Bandwagon
Phil Garrou went to the International Interconnect Technology Conference (IITC) last month and found some 3-D gems from Freescale, IMEC, LETI and TSMC. The TSMC paper generated a lot of interest, given the foundry's announcement that it would support 3-D interconnects. "The presentation by H.J. Tu, while not divulging their ultimate preferred process sequence, did show enough real data to indicate that they are serious," Garrou writes, adding that "we all eagerly await further process data from TSMC."