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May 21, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
A week after a 7.9-magnitude earthquake centered in China's Sichuan Province rattled much of China on May 12, Intel and other tech companies in the area are reporting no injuries or serious damage. Located ~88 km (55 miles) southeast of the epicenter, Intel's Chengdu test and assembly plant halted production for a few days to inspect the facility for structural damage, but it has since reopened and is ramping as quickly as possible. Intel said the facility was built to U.S. earthquake standards. For more advanced packaging news and events, visit our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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Intel Reopens Plant Hit by China Quake
Reuters, 5/20/2008
Intel Corp. said yesterday it has reopened its chip assembly and test facility in Chengdu, China, a site 55 miles from the epicenter of the massive earthquake that rattled Sichuan province on May 12. "We are ramping it up as fast as we can," Intel spokesman Chuck Mulloy said, without giving an estimate on when the facility would return to full capacity. More |
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Avago Announces RF Chip-Scale Packaging Technique
Business Wire, 5/12/2008
Avago Technologies announced a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high-frequency performance to new levels. More |
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STATS ChipPAC Qualifies Fan-In PoP
Market Wire, 5/12/2008
STATS ChipPAC Ltd. announced that it has completed full internal qualification of its fan-in package-on-package (FiPoP) technology. More |
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Ultratech Receives Advanced Packaging System Order
PR Newswire, 5/19/2008
Ultratech Inc. announced that it has received an order from the largest foundry in the world for its AP300 advanced packaging lithography system. The order represents the initial step in the foundry customer's volume expansion plans for 300 mm wafer-level packaging (WLP) and solder bump applications. More |
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Rudolph Announces Wafer Scanner for 3-D Bump Metrology
Business Wire, 5/15/2008
Rudolph Technologies Inc. announced the release of the new WS 3840, its latest addition to the Wafer Scanner product family for inspection and metrology of back-end semiconductor manufacturing processes, including bumping, probing, sawing and dicing. More |
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Renesas Adopts Cadence Encounter for SoC, Flip-Chip Design
Market Wire, 5/12/2008
Cadence Design Systems Inc. announced that Renesas Technology Corp. has successfully taped out its most advanced and large-scale system-on-a-chip (SoC) design to date using the Cadence SoC Encounter system. More |
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Mitsubishi, Renesas Develop Solder Tool for Fine-Pitch BGAs
Kenji Tsuda, Asia Contributing Editor — Semiconductor International, 5/14/2008
Engineers from Mitsubishi Electric and Renesas Technology have developed a solder ball machine tool that can deposit 13-µm-diameter balls using a lead-free solder alloy of silver and tin. While the tool has a throughput that makes it suitable for prototyping thus far, it may enable smaller-pitch BGA packaging. More |
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Semiconductor International is the leading technical
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Overcoming Performance Bottlenecks With Embedded Active Chips
Jitesh Shah and Tu Vu, Integrated Device Technology, San Jose — Semiconductor International, 5/1/2008
Embedding a chip in the core of the substrate helps overcome performance bottlenecks by bringing terminals on the chip almost to the circuit board level — improving signal quality and power supply noise performance thanks to a relatively short interconnect distance from chip to circuit board. More |
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Freescale Taking Redistributed Chip Packaging to Pilot Production
David Lammers, News Editor — Semiconductor International, 5/12/2008
After six years of development, Freescale Semiconductor Inc. (Austin, Texas) is moving its pioneering redistributed chip packaging (RCP) technology to early commercial production, said Navjot Chhabra, RCP operations manager. More |
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Acoustic Profiling Module
C-Sam acoustic microscopes have been expanded to include the acoustic surface profile (ASP) module. ASP works by collecting acoustic surface data and displaying it as a color-coded image, where every color corresponds to a topographical distance measurement.
Sonoscan Inc., Elk Grove Village, Ill.
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Pick-and-Place Handler
MT2168 is a pick-and-place platform optimized for parallelism, test time and throughput requirements. The handler can process thicknesses from 10 mm down to 0.3 mm.
Multitest elektronische Systeme GmbH, Rosenheim, Germany
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| Online Buyer’s Guide: Your Search Starts and Ends Here |
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Search Semiconductor International’s Online Buyer’s Guide for products, services and vendors, or browse through product categories. It's the comprehensive buyers guide for the global semiconductor manufacturing industry. To see the latest company listings and product information, visit:
buyersguide.semiconductor.net
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May 27-30, 2008: ECTC 2008
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June 1-4, 2008: IEEE International Interconnect Technology Conference
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June 2, 2008: Future Advanced Packaging Technology
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June 10-12, 2008: International Conference on Electronics Packaging
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