Semiconductor International NewsBreak
TOP STORY... May 13, 2008

New Probe Preps AFM for Inline Metrology
Researchers at the Georgia Institute of Technology (Atlanta) have developed atomic force microscopy (AFM) probes that can quickly measure material properties such as adhesion, stiffness, elasticity and viscosity, in addition to the traditional topography scan. Instead of a cantilever, the probe uses a drum-like membrane from which the tip extends to scan the sample. In one scanning mode, as the tip moves about a surface, it lightly taps it, gathering information about the forces acting on the tip while sensing the material's shape, stiffness and adhesion properties.
Read more >>		 MORE NEWS...

SunPower Claims World-Record Solar Cell Efficiency

Raytheon-Led Team Grows Compounds on Silicon

Sunfilm to Expand Production With Applied SunFab Line

STATS ChipPAC Qualifies Fan-In PoP

Avago Announces RF Chip-Scale Packaging Technique

AMD Creates Central Engineering Organization

FSI Ships Single-Wafer Cleaning Technology for 32 nm

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Perspectives From the Leading Edge: SMTA 3-D Meeting in Research Triangle Park
Phil Garrou blogs on the 3D/SiP Advanced Packaging Symposium organized by the Surface Mount Technology Association (SMTA, Edina, Minn.). He reports that IBM Packaging Manager Biao Cai revealed that through-silicon via (TSV) technology is under evaluation for 2012 and beyond for DDR3-DDR4 DRAMs used in servers. Also, Paul Sibelrud of Semitool described the EMC-3D consortiums cost study. Using the Sematech cost of ownership model, EMC-3D claims that 3-D IC integration will be down to $162/wafer sometime in 2009. Garrou's comment? "I think this is aggressive, but hope it is correct."

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