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March 19, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
As IDMs and OEMs continue to adopt outsourcing business models and the industry increasingly transistions to advanced packaging technologies, the worldwide semiconductor assembly and test services (SATS) market showed modest growth (up 7.4% at $20.6B in 2007), according to Gartner (Stamford, Conn.). It outpaced the overall semiconductor market by more than 50%. Also interesting, Gartner said the top five SATS vendors managed to hang onto their rankings in 2007 — with ASE in the top spot, followed by Amkor, SPIL, Stats ChipPac and UTAC. You can read more about this in the news below, and remember to look for more packaging news and events on our Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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Advertisement |
| Thru-Silicon-Via (TSV) Foundry Services |
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ALLVIA, Inc. provides Thru-Silicon Via foundry services to MEMS and Semiconductor Industries meeting the demands of advanced vertical interconnects and System-in-Package (SiP) solutions. Through Silicon Vias provide the shortest electrical path between two sides of Silicon Die, allow miniaturization through 3D stacking, and support wafer level packaging (WLP) for RF and MEMS devices. With a full line of in-house processing equipment, ALLVIA offers services for prototyping as well as volume production runs.
Click here.
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Stats ChipPac Introduces IPD Library Tool for RF Designs
Market Wire, 3/18/2008
STATS ChipPAC Ltd. announced a new integrated passive device (IPD) Products Databook that contains a library of silicon-based IPD designs to assist semiconductor companies in reducing design cycle time and increasing integration options in RF applications. More |
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Tessera Incorporates TSVs Into Optoelectronics Packaging
Sally Cole Johnson, Contributing Editor — Semiconductor International, 3/18/2008
In a déjà vu manner, Tessera Technologies Inc. (San Jose) recently acquired a few more smart optics and imaging companies — namely EyeSquad and FotoNation — and quickly turned out another advanced wafer-level chip-scale packaging (WLCSP) technology for image sensors and other optical devices destined for electronic products with a camera. More |
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Test, Packaging Growth Hits 7.4% in 2007
Staff — Semiconductor International, 3/12/2008
Gartner Inc. said the worldwide market for semiconductor assembly and test services (SATS) grew by 7.4% to $20.6B in 2007. For 2008, Gartner forecasts another year of growth, with initial estimates for 9.8% growth compared with 2007. More |
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FlipChip Announces Opening of 3-D Packaging Innovation Center
PR Newswire, 3/17/2008
FlipChip International (FCI) announced the official opening of its FABLAB & Center of Innovation aimed at enabling future generations of wafer-level chip-scale packaging (WLCSP) and 3-D packaging technologies. This new semiconductor development center is located at FCI's primary location in Phoenix. The FABLAB concept supports ongoing strategic process and material development activities while, at the same time, enabling advanced prototyping of leading-edge and non-standard wafer-level solutions in emerging product applications. More |
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DuPont Packaging Lithography Announces WBR 2000 Films
Product News Network, 3/11/2008
DuPont Advanced Packaging Lithography, part of DuPont Electronic Technologies, has announced the full commercialization of DuPont WBR 2000 Series dry film photoresist material for advanced semiconductor packaging applications, including electroplated solder, photostencil and copper pillar bumping. More |
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Tessera Arbitration With Amkor to Proceed
Business Wire, 3/10/2008
Tessera Technologies Inc. announced that the seven-day hearing for its arbitration with Amkor Technology Inc. will proceed on March 31, 2008, as scheduled. The ongoing arbitration seeks to resolve Amkor's failure to pay royalties due to Tessera under the company's license agreement. Tessera is seeking a substantial monetary recovery for Amkor's use of Tessera technology. More |
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Advertisement |
| 58th Electronic Components & Technology Conference:
ECTC 2008 |
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ECTC 2008 will be held May 27 - 30, 2008 at Disney's
Contemporary Resort in Lake Buena Vista, Florida, USA.
This year's conference will include 38 technical sessions,
16 professional development courses, a panel discussion,
a plenary session, a CPMT Seminar, and a technology corner
with over 70 exhibitors.
Register now!
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Technology Platform Integrates High-Performance SiP Modules
G. Carchon and G. Posada, IMEC, Leuven, Belgium — Semiconductor International, 3/1/2008
Using a high-resistivity silicon interposer, thin-film technologies and through-substrate vias, 3-D integration of high-quality passives and high-speed digital devices becomes possible. More |
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Controlling Plating Baths in TSV Applications?
Michael Pavlov, Eugene Shalyt and Peter Bratin, ECI Technology, Totowa, N.J. — Semiconductor International, 3/1/2008
When combined with non-reagent techniques, CVS analysis can ensure appropriate concentrations of inorganic components in electroplating baths, a necessary step in bringing through-silicon via (TSV) processes to production-worthy status. More |
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Ceramic Heaters for Die Bonding Processes
Hongy Lin and Jim Kreisel, Watlow, Fenton, Mo. — Semiconductor International, 3/1/2008
Using a finite element model, an aluminum nitride (AlN) heater was developed that meets the aggressive requirements of semiconductor die bonding and IC testing applications. More |
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Advertisement |
| March 25—Through-Silicon Vias: Ready for Prime Time? |
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In this webcast, a panel of experts will discuss
the various etch, deposition and plating processes
required for fabricating TSVs, focusing on unsolved
manufacturability challenges. Panelists include:
Philip Garrou of Microelectronic Consultants of NC,
Jan Vardaman of TechSearch International, and
Fred Roozeboom of NXP Semiconductors.
Register Now!
Sponsored by: ECI Technology, Surface Technology Systems & ALLVIA, Inc.
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Scalable Dispensing Platform
The Spectrum S-920 Series of scalable dispensing platforms adapts to the needs and requirements of high-volume microelectronics manufacturing and PCB assembly, such as flip-chip and underfill. It has technologically advanced and integrated software and hardware control based on Fluidmove XP software with process control features.
Asymtek, Carlsbad, Calif.
More |
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BGA Interposers
BGA interposers were created for converting lead-free BGA device packages for use on boards processed with lower-temperature tin/lead solder profiles.
Advanced Interconnections Corp., West Warwick, R.I.
More |
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Wafer Probe Card
TrueScale PP40 is a wafer probe card designed to enable high-efficiency and high-parallelism wafer probing on advanced wire bond logic and SoC devices.
FormFactor Inc., Livermore, Calif.
More |
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Advertisement |
| Is Your Product Among the Best of the Best? |
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Don't miss your chance to be recognized with a 2008 Editors' Choice Best Product Award! Enter your product in the 19th annual awards, judged by Semiconductor International's editors, with winners recognized in SI's July issue, as well as a ceremony at SEMICON West. Entry deadline is March 31, 2008.
Get more information and download the entry form today!
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March 25, 2008: Webcast: Through-Silicon Vias: Ready for Prime Time?
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April 8, 2008: Nanoelectronics, Nanofabrication and Nanometrology
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June 2-4, 2008: IEEE 2008 International Interconnect Technology Conference
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