| Dear Subscriber,
In our last issue, I asked for feedback from readers about the inaugural International Workshop on EUV Lithography. Thanks to everyone who got back to me for your insight. I've included some of the feedback here, including a guest posting on the Fine Print blog (where you can also chime in with your own comments), Chris Mack's posting on his own blog, and a podcast interview with the workshop's creator, Vivek Bakshi. Check out the links to this content in the Editor's Picks section, as well as the latest news in the world of lithography. Keep up with all the latest coverage on our Lithography Technology Channel:
www.semiconductor.net/lithography
Aaron Hand, Executive Editor, Electronic Media
ahand@reedbusiness.com |
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Cymer's Year-End EUV Goal: A Full Shift
David Lammers, News Editor — Semiconductor International, 7/9/2008
Cymer Inc. seeks eight hours of continuous operation for its laser-produced plasma (LPP) source for EUV lithography. The goal is to ensure a full shift of continuous source power operation by the end of this year, at 100 W power levels. More |
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Rohm and Haas Opens Immersion R&D Facility
Staff — Semiconductor International, 7/8/2008
Rohm and Haas Electronic Materials opened an R&D facility to develop materials used in 193 nm immersion lithography. The company invested ~$60M, installing an immersion scanner, track and other tools at the company's Advanced Technology Center (ATC) in Marlborough, Mass. More |
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Obducat Rolls Sindre for Patterned Media
David Lammers, News Editor — Semiconductor International, 7/7/2008
Sweden's nanoimprint lithography (NIL) vendor Obducat AB is competing for the nascent market for hard disk drive media with discrete tracks and magnetic pillars. Obducat uses an intermediate polymer system (IPS) to protect the template, and employs simultaneous thermal and UV (STU) energy to harden the patterns. More |
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Cymer Inks Multi-Unit Source Agreement With Toshiba
Business Wire, 7/8/2008
Under the agreement, Toshiba will include Cymer's KrF and ArF light sources in Toshiba's future 300 mm investment plan at its memory fab in Japan. More |
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Austria Launches Nanoimprint Lithography Project
Staff — Semiconductor International, 7/2/2008
The Austrian government will fund a series of nanoimprint lithography (NIL) research projects. The "NILaustria" project will focus on large-area nanostructuring, using NIL to transfer different nanostructures to large surfaces in a cost-efficient manner. More |
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Eynon and Hofemann Join Molecular Imprints
PR Newswire, 7/1/2008
Ben Eynon has joined the nanoimprint toolmaker as vice president of marketing and business development for semiconductors, and Paul Hofemann will serve as vice president of marketing and business development for hard disk drives and emerging markets, respectively. More |
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Photoresist Revenue Up 14.5% in 2007, Gartner Reports
Ann Steffora Mutschler, Senior Editor — Electronic News, 6/26/2008
Worldwide sales of semiconductor photoresist grew by 14.5% in 2007 to reach $1.2B, according to market research company Gartner Inc. More |
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Dow Corning Spins E-Beam Resist
David Lammers, News Editor — Semiconductor International, 6/24/2008
Dow Corning Corp. is selling an e-beam resist that supports 6 nm features, with good line edge roughness. Although the sensitivity of the resist is not good enough to support high-volume manufacturing, the company intends to further improve it to support higher throughputs. More |
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Nanomirrors Could Enhance EUV Lithography, Telescopes
David Chandler — Space Daily, 6/27/2008
A new way of bending X-ray beams developed by MIT researchers could lead to greatly improved space telescopes, as well new tools for biology and for the manufacture of semiconductor chips. More |
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Toppan Offers 32 nm Photomask Manufacturing
Business Wire, 6/12/2008
Toppan Printing Co. Ltd. announced that it is the first photomask maker to develop a 32 nm photomask manufacturing process, and was set to begin volume production in June. More |
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| Webcast: Preparing for High-Volume Immersion Lithography |
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Broadcast in both English and Japanese, this on demand webcast looks at the most pressing challenges facing immersion lithography and the solutions that are being worked on. Panelists include: Soichi Inoue, Toshiba Semiconductor Co.; Burn Lin, TSMC; Kurt Ronse, IMEC; Bryan Rice, Sematech.
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Sponsored by: ASML
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The Fine Print: Who's Minding the Litho Store in Albany?
Aaron Hand, Executive Editor, Electronic Media — Semiconductor International, 7/1/2008
Molecular Imprints Inc. (Austin, Texas) put out a press release announcing the appointment of Ben Eynon as the company's vice president of marketing and business development for semiconductors. No wonder Sematech folks were being so cagey in May when talking about when Eynon would be taking over from Mike Lercel as lithography director. Blog |
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Lithoguru: Aloha From the EUV Islands
Chris Mack, Lithoguru.com, 6/18/2008
Chris Mack, litho guru and gentleman scientist, gives his behind-the-scenes perspective on the International Workshop on EUV Lithography, where he gave a talk and presented a full-day course on line edge roughness. Blog |
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The Fine Print: EUV Lithography Workshop: A Guest Perspective
Kenneth Goldberg, Lawrence Berkeley National Laboratory — Semiconductor International, 6/17/2008
Kenneth Goldberg, a physicist at Lawrence Berkeley National Laboratory (LBNL) who works on EUV lithography issues, primarily optics testing (EUV interferometry) and EUV actinic mask inspection (AIMS-type and scanning), offers his view on the International Workshop on EUV Lithography. He notes: "The usual emphasis on 'latest and greatest' was replaced with a 'How are we going to make this work?' approach to the field." Blog |
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Advocating More Open Communication on EUV Lithography
Aaron Hand, Executive Editor, Electronic Media — Semiconductor International, 7/9/2008
Vivek Bakshi, founder and president of EUV Litho Inc., explains why he started up the International Workshop on EUV Lithography, which took place in Maui in June. He also expands on recent developments in EUV, and why more research is needed. Listen |
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Photoresist Remover
EKC162 is a WLP photoresist remover that dissolves photoresist without attacking polyimide or metal layers. It has been formulated to enhance the removal of resists cleanly and efficiently with full dissolution.
DuPont EKC Technology, Danville, Calif.
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Imprint Lithography Tool
Imprio 300 is an imprint lithograpy tool that provides sub-10 nm resolution patterning in a single exposure. Overlay is easier to achieve because the company's S-FIL (Step and Flash imprint lithography) technology imprints into liquid droplets rather than a solid.
Molecular Imprints Inc., Austin, Texas
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Sept. 22-25, 2008: International Symposium on Immersion Lithography Extensions
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Sept. 28-Oct. 1: International Symposium in EUV Lithography
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Oct. 6-10, 2008: SPIE Photomask
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