Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... June 30, 2008

SMIC Lays Foundation
for Shenzhen Fab
Semiconductor Manufacturing International Corp. (SMIC, Shanghai) kicked off construction of the 200 mm fab it is building in the southern city of Shenzhen, with support from the Shenzhen city government. The line is expected to begin pilot production late next year, followed by construction of a 300 mm line.
Read more >>


 MORE NEWS...

Worldwide YoY Chip Sales Up 7.5% in May

Major Deal Between IBM, New York in the Works

LDK Solar CEO Aims to be Largest Solar Wafer Producer

Taiwan May Allow 300 mm Fabs in China With UMC Impact

IBM, Zurich University to Build Nanotech Lab

Orders for Japan-Made Equipment Fall for 15th Month

National Semiconductor Enters Photovoltaic Market

MORE >>

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Views on News: IBM@45: eDRAM, Si! High-k, No
IBM Corp. plans to implement embedded DRAM (eDRAM) for its server microprocessors at 45 nm and then introduce high-k/metal gate technology at the 32 nm node, writes News Editor David Lammers. Gary Patton, vice president of technology development at IBM's Semiconductor R&D Center (Fishkill, N.Y.), said, "For our systems [server] business, the focus at 45 is to get eDRAM into our technology because bandwidth is by far one of the most important technologies."

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