Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... June 26, 2008

IBM Takes Gloves Off for 32 nm Low-Power Competition With TSMC
IBM engineers described the Fishkill alliance's low-power 32 nm process technology, which includes a high-k/metal gate stack, at the 2008 Symposium on VLSI Technology. IBM Vice President Gary Patton said the insertion of high-k will give the partners several advantages over foundry rival TSMC, which plans to stick with an oxide/poly gate stack. "Poly oxynitrides are going to be quite a bit more expensive than using high-k/metal gate at 32 nm," Patton said.
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Hamamatsu Enhances Thermal Imaging Sensitivity
Hamamatsu’s Themos-1000 True Thermal emission microscope delivers 100 times greater thermal sensitivity and improved resolution for the localization of heat related semiconductor defects including shorts and leakage and is an ideal complement to OBIRCH and other laser techniques for dynamically powered devices. Click here.
FEATURED ARTICLE...

2008 SEMICON West
SEMICON West 2008 runs its course over three days of keynotes, TechXPOTs, short courses, workshops and more. SI Managing Editor Jennifer Yario navigates the high points of the July 15-17 schedule in our mid-June SEMICON West preview issue.

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'Litho Forum Survey: EUV by 2016?' On Demand Webcast
Find out what the leading chipmakers and industry experts have to say about insertion schedules and readiness assessments of future lithography technologies in this presentation of the full results from surveys conducted before and after this year's Sematech Litho Forum.
View now!

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