Entangled Images Point to Better Quantum Data, Optical Measurements
Alexander E. Braun, Senior Editor — Semiconductor International, 6/16/2008

Researchers at the Joint Quantum Institute (JQI) of the National Institute of Standards and Technology (NIST) and the University of Maryland used a convenient and flexible method for creating twin light beams to produce "quantum images," which are pairs of information-rich visual patterns whose features are "entangled" or inextricably linked by the laws of quantum physics. Besides promising better detection of faint objects and improved amplification and positioning of light beams, the technique might be useful for storing data patterns in quantum computers and transmitting highly secure encrypted information. More

Single-Digit Growth in Semiconductor IP Market Pushes Consolidation
Suzanne Deffree, Managing Editor, News — Electronic News, 6/23/2008

As growth rates decline, small to mid-size IP vendors should prepare to acquire other companies, or be acquired, as consolidation has become the key strategy for gaining scale and remaining in the IP market, according to Gartner. The research company warns that a period of single-digit growth in the semiconductor IP market, which will encourage further consolidation, is ahead. More

ATE Industry Maneuvers Around 'Perfect Storm' of Issues at 90 nm and Below
Sally Cole Johnson, Contributing Editor — Semiconductor International, 6/12/2008

According to the 2007 International Technology Roadmap for Semiconductors (ITRS), the most immediate technology challenge the ATE industry faces is "test for yield learning" — essential for fab process and device learning below the wavelength of light or the sub-optical space of 90, 65 and 45 nm, and future process nodes. Discrete challenges are combining to create a "perfect storm" for ATE vendors, while they also take on design sensitivity issues occurring at 90 nm and below. More

VLSI Research Ranks Top Equipment Vendors
Staff — Semiconductor International, 6/11/2008

VLSI Research Inc. announced results for its annual customer satisfaction survey by vendors of process diagnostics equipment and suppliers of processing equipment. The top-rated suppliers in the three categories are Keithley Instruments, SEN Corp. and Varian Semiconductor. Each supplier was rated on 13 different metrics that encompass both equipment performance and customer service. More

SEA TADPOLE Promises Metrology Improvements
Alexander E. Braun, Senior Editor — Semiconductor International, 5/29/2008

The use of ultrashort laser pulses in metrology and other applications is diminished by spatio-temporal distortions. To become ultrashort, these pulses must be massively manipulated, becoming dispersed, amplified, elongated and compressed. Unless the devices producing them are precisely aligned, spatio-temporal distortions are introduced. A Georgia Institute of Technology research group has developed techniques for measuring ultrashort laser pulses. The techniques have applications for spectroscopy, microscopy and even lithography, which sometimes uses short pulses. More

MEMS Create 3-D Inspection Challenges
Jon Titus, Contributing Technical Editor — Test and Measurement World, 6/1/2008

The diversity of MEMS devices presents vendors and users of inspection system with a sizeable challenge. More

FormFactor Appoints CEO, Chairman
Market Wire, 6/3/2008

FormFactor Inc. announced that its board of directors has appointed Mario Ruscev, currently president, as its next CEO. Ruscev will succeed Igor Khandros, FormFactor's founder, who will become executive chairman of the FormFactor board of directors. More

KLA-Tencor Completes First Stage of Acquisition of ICOS Vision Systems
Business Wire, 6/2/2008

KLA-Tencor Corp. announced that it has finalized its purchase of the shares of ICOS Vision Systems. More

Ruminations on What Might Have Been
Alexander E. Braun, Senior Editor — Semiconductor International, 6/12/2008

Senior Editor Alex Braun reviews the history of Charles Babbage's Difference Engine No. 2, which was designed to revolutionize calculations by mechanizing them, as well as his more revolutionary Analytical Engine, which would have been the world's first true computer. While the inventor did not live to see any of his creations built, there are two Difference Engines in existence today. A fascinating video of this stunning creation in operation is also available. Blog

CD Metrology Confidently Looks Beyond 32 nm
Alexander E. Braun, Senior Editor — Semiconductor International, 6/1/2008

Although traditional tools are showing signs of reaching their limits, workarounds and more complex models, added to new technologies, should continue providing the needed accuracy and precision to control processes and perform inspection, measurement and test. More

Yield Goals for 22 nm
Dilip Patel, Kye-Weon Kim, Doron Arazi, John Allgair, Benjamin Bunday, Milton Godwin, Victor Vartanian, Pete Lipscomb and Aaron Cordes, International Sematech Manufacturing Initiative (ISMI), Austin, Texas — Semiconductor International, 6/1/2008

Semiconductor manufacturers face defect, film and lithography metrology issues in the move to 32 nm. Optical defect inspection tools do not adequately detect defects at 45 nm, while SEMs are too slow. With each technology node, CD metrology measurements become more difficult because CD-SEM and OCD measurement capability limits are being reached. More

SEMICON West 2008 Executive Outlook
Staff — Semiconductor International, 6/15/2008

Top executives of some of the major metrology providers discuss the future of their technologies. In the front end, all eyes are on the extension of 193 nm lithography with immersion and double patterning, along with making high-k/metal gate processes more cost-effective. Meanwhile, real 3-D integration is occurring with package-on-package (PoP) and 3-D ICs using through-silicon vias (TSVs). Executives throughout the industry are emphasizing the importance of energy conservation, cost-effectiveness and high productivity — key measures going forward. More

Assessing Component Damage, Failure Risk
Ray Thomas, Sonoscan, Elk Grove Village, Ill.; Paul Melville NXP Semiconductor, Eindhoven, Netherlands — Semiconductor International, 6/1/2008

Acoustic imaging, combined with electrical testing, provides insight into the cause of electrical failure in plastic packages. More

200 mm Prober

Wafer Inspection Module

MX2000IR is a wafer inspection system with automatic robotic handling. For 150 and 200 mm wafers, 1-4 cassettes holding up to 25 wafers each can be automatically loaded. For 300 mm wafers, FOUP stations are available, so the robot takes the wafer directly from the station.
Viscom Inc., Hanover, Germany
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XRF Film/Composition Tool

July 2, 2008: Regional Metrology Surgery

July 15-17, 2008: SEMICON West