Semiconductor International NewsBreak
TOP STORY... June 24, 2008

Dow Corning Spins
E-Beam Photoresist

Dow Corning Corp. is selling an electron-beam (e-beam) resist that supports 6 nm features, with good line edge roughness. While the sensitivity of the resist is not good enough to support high-volume manufacturing, the company intends to further improve the resist to support higher throughputs.
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MORE NEWS...

DuPont Electronic Raises Prices by 20%

ASMI Awaits Court Decision; Investors Wait for AMAT

SEMI Announces Four New Manufacturing Standards

ON Semi, Tower Semi Begin Multi-Year Collaboration

Solar Cell, Semi Industry Investments Equal by 2010

MIT Energy Initiative, Bosch Announce Energy Collaboration

Samsung Denies Taiwan Report of Defective DRAMs

MORE >>

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FEATURED ARTICLE...

SEMICON West 2008 Executive Outlook
To get in the mood for SEMICON West 2008, which starts in three weeks in San Francisco, consider these C-level thoughts contributed to SI's Mid-June show planner issue. Managers are emphasizing the importance of energy conservation, cost-effectiveness and high productivity — key measures going forward. In the front end, all eyes are on the extension of 193 nm lithography with immersion and double patterning, along with making high-k/metal gate processes more cost-effective. Meanwhile, real 3-D integration is occurring with package-on-package (PoP) and 3-D ICs using through-silicon vias (TSVs).

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