Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... June 12, 2008

ATE Industry Maneuvers
Around 'Perfect Storm' of
Issues at 90 nm and Below
Integration is introducing more complexity to the automatic test equipment (ATE) equation. System-in-a-package (SiP) solutions appear to be gaining ground on system-on-a-chip (SoC) designs; both present difficult challenges to the ATE industry as designs move to 90 nm and below. To reduce costs, ATE vendors are also developing a way to provide test for yield learning.
Read more >>


 MORE NEWS...

Vitex Systems' Laminates Protect Flexible CIGS Solar Cells

Spire to Introduce 25 MW Line at Intersolar Show

Silicon Wafer Revenue Up 22.5% in 2007

Arise Signs Six-Year Agreement for Wafers From ReneSola

MORE >>

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FEATURED WEBCAST...

SIA Semiconductor Industry Forecast Mid-Year Update 2008-2011
The SIA has taken a decidedly optimistic view of the semiconductor industry through the year 2011. SIA President George Scalise said that the energy issues and gas prices in the United States have had no impact on consumer spending to date. Learn more details of the SIA mid-year forecast in this webcast, which aired yesterday.

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