Yield Goals for 22 nm
Dilip Patel, manager of the defect metrology program at the International Sematech Manufacturing Initiative (ISMI, Austin, Texas), together with eight other ISMI authors, describes defect metrology challenges at 32 nm. Writing in the June issue of Semiconductor International, the authors detail a range of challenges — from monitoring haze to bevel/edge inspection — that need to be addressed. Also, ISMI is engaging with tool suppliers to develop new metrology solutions, such as applying conductive carbon nanotubes (CNTs) to scanning probe microscopy.