Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... June 4, 2008

IITC Papers Range From
Plasma Modeling to Copper Encapsulation Techniques
Papers presented at this week's International Interconnect Technology Conference (IITC) include work on modeling, plasma-enhanced atomic layer deposition, and thin self-aligned barrier layers that inhibit electromigration at the 32 nm node and beyond when combined with encapsulated copper wiring.
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 MORE NEWS...

Freescale East Kilbride Closure Would Impact 850 Jobs

Hemlock Semiconductor Expansion to Double Polysilicon Supply

Deal With State Sought to Enhance IBM Fishkill Plant

Survey Reflects Interest in SOI for Low Power

FormFactor Appoints CEO, Chairman

MORE >>

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FEATURED WEBCAST...

Litho Forum Survey: EUV by 2016?
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June 11: SIA Industry Forecast 2008-2011
Tune in to this mid-year webcast for the latest SIA forecast of global semiconductor sales through 2011. SIA President George Scalise will offer comments and analysis of what may lie ahead for the global chip industry.
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