Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... June 2, 2008

IITC Gives Glimpse
of Future Interconnect

Researchers at the 2008 International Interconnect Technology Conference (IITC), which opened today, will present papers on 3-D interconnects, ruthenium wiring and air gap-enhanced dielectrics. In research that may set a direction for future work, an invited paper by Georgia Tech compares copper to graphene and carbon nanotubes. The conference is sponsored by IEEE, the Electron Devices Society and Semiconductor International.
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MORE NEWS...

Chip Market Researchers Turn Bullish

Nantero, SVTC Offer CNT Capability at Two Pilot Fabs

TSMC Joins IPL Alliance as First Foundry Member

SAFC Hitech Launches Metalorganic Bulk Vapor Distribution System

April Semiconductor Sales Up 6%

KLA-Tencor Completes First Stage of ICOS Acquisition

MORE >>

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CD Metrology Confidently Looks Beyond 32 nm
Wayne McMillan, marketing director at KLA-Tencor, describes the use of scatterometry for gate control measurements in an article in the June issue of Semiconductor International by Senior Editor Alexander Braun. Optical critical dimension (OCD) techniques are "critical to measure the depth and undercut beneath the gate to determine stress," McMillan said.

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