Perspectives From the Leading Edge: 3-D Road Tour Continued
Philip Garrou blogs from the SUSS/STS/NEXX Systems-organized 3-D road trip, where Bob Patti, CTO at Tezzaron Semiconductor (Naperville, Ill.), talked about how split die memory can be 3-D connected at a typical attachment cost of <0.01 cents per connection. Garrou also describes work presented by Ziptronix Inc. (Research Triangle Park, N.C.) CTO Paul Enquist on the company's direct bond interconnect.