Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... May 28, 2008

Alchimer Ready to Tackle
TSV Seed Layer

Following an IP licensing business model, Alchimer SA (Massy, France) said it is ready to do business in the 3-D interconnect sector, offering its unique electrografting (eG) process on available electroplating tools. Alchimer CEO Steve Lerner said the "eG ViaCoat" solution will reduce the costs associated with TSVs by replacing the physical vapor deposition (PVD) steps now used for seed deposition with eG.
Read more >>



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