Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... May 19, 2008

Novellus Offers Dry Strip Tools for HV Memory, Advanced Logic
Novellus Systems announced two derivatives to its Gamma Express dry strip and clean platform: the G400, aimed at high-volume memory fabs, and the GxT, targeting the needs of advanced logic customers. The company developed a continuous RF capability that boosts throughput by continuing to ash even as wafers are moved from one station to the next.
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 MORE NEWS...

Softer Memory Market Impacts Probe Card Manufacturers

ASM ALD Process Simplifies High-k Integration

Frigid Flub $883K Error

Dow Corning Opens Solar Center in Michigan

Global Equipment Sales Up 1.9% in FY 2007

Maryland Researchers Tout Graphene's Advantages

Germany Reevaluates Solar Subsidies

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May 20: Can Copper Deposition Break the 32 nm Barrier?
It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this webcast, a panel of industry experts will discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY, Zsolt Tökei of IMEC, and Daniel Josell of NIST.
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Sponsored by: Jordan Valley

FEATURED BLOG...

Perspectives From the Leading Edge: Road Trip Revelations
Phil Garrou blogs on a road trip he took with members of a "loosely affiliated group" of companies interested in 3-D interconnect technology. On the road, Garrou got a clearer look at Micron Technology's extensive 3-D plans, including some roadmap screenshots showing metrics of the via, pitch and aspect ratio. Micron's Kyle Kirby provided details on 3-D packaging for stacked DRAM, memory-on-processor and NAND, Garrou writes.

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Fabless Semiconductor Live Webcast
Join thought-leaders from SAP, Bristlecone and Gennum Corporation for a live Webcast on Wednesday, June 4, 2008 at 1:00 p.m. ET-- to find out how the semico company, Gennum Corporation, is adopting a fabless manufacturing model -- to become more competitive. Register today to learn how modeling the SAP solution can help overcome the inherent challenges.
Register now!

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