Semiconductor International NewsBreak
TOP STORY... May 12, 2008

Freescale Taking RCP
to Pilot Production Stage
Freescale Semiconductor Inc. is moving its pioneering redistributed chip packaging (RCP) technology to pilot production, said Navjot Chhabra, RCP operations manager. Wafers holding RCP-optimized chips aimed at MP3 players were received at Freescale's Tempe, Ariz., facility earlier this month. After several months of pilot-mode production in Tempe and product certification at the two initial customers, RCP will move to volume production in the first quarter of 2009.
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 MORE NEWS...

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Applied Announces SunFab Performance Service

Nanometrics Targets Solar Manufacturing Industry With Tevet Acquisition

Hyundai to Build $181M Solar Cell Plant

TSMC, UMC April Sales Up Y/Y, Q/Q

Pure-Play Foundries Comprise 84% of Market

MORE >>

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FEATURED ARTICLE...

Package-on-Package Variations On the Horizon
The future for package-on-package (PoP) technology continues to look bright for products that require increased performance, smaller form factors, and different memory configurations and interfaces, writes Flynn Carson, a vice president at STATS ChipPAC. As the PoP format has matured, other applications besides mobile phones are beginning to reap the benefits of PoP, Carson wrote in a contributed web exclusive article for Semiconductor International.

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