Semiconductor International NewsBreak

Semiconductor International NewsBreak

TOP STORY... May 7, 2008

Haze, Still Misunderstood,
Costing Industry $1B a Year
Arguably the single largest yield detractor in the semiconductor industry, costing the industry about a billion dollars every year, micro-contamination is still very little understood or acknowledged by semiconductor fabs. Industry experts discussed the issues and various solutions in a session yesterday on time-dependent haze at ESTECH 2008.
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MORE NEWS...
Applied Tackles Edge With Inflexion Polishing System

Silicon Wafer Shipments Flatten in First Quarter 2008

Nextreme OptoCooler Module Aimed at High Heat-Flux Optoelectronics

AMD Stock Surges on Split Rumors

Asyst Reports Results for 4Q of Fiscal 2008

Aviza Announces Fiscal Year 2008 2Q Results

MORE >>

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FEATURED ARTICLE...
Self-Aligned Barrier Improves Interconnect Reliability
Authors from Novellus Systems write about the ever-increasing electromigration (EM) requirements in copper interconnects in Semiconductor International's May issue. The interface between the dielectric diffusion barrier and copper has been shown to be the weakest link in resisting EM failure. The answer? A plasma-enhanced chemical vapor deposition (PECVD) self-aligned dielectric barrier.

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May 20: Can Copper Deposition Break the 32 nm Barrier?

It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this webcast, a panel of industry experts will discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY, Zsolt Tökei of IMEC, and Daniel Josell of NIST.
Register now!

Sponsored by: Jordan Valley

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