Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... May 6, 2008

Physical Analysis Provides
Images of 45 nm

Speaking at the Advanced Semiconductor Manufacturing Conference (ASMC) in Cambridge, Mass., Chipworks Inc.'s Senior Technology Analyst Dick James described what the teardown firms' latest analyses have revealed. James outlined two 45 nm chips: the Intel Xeon and Matsushita Electric Industrial Co. Ltd. UniPhier. "We are quite convinced that manufacturers are getting strain using very thin nitride layers," James said.
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FEATURED BLOG...

Views on News: The Other 450 mm Shoe
The four companies openly pushing for 450 mm wafers are working on a plan to subsidize the equipment industry's 450 mm development effort, writes SI News Editor David Lammers. The carrot will be large, perhaps approaching a billion dollars when all is said and done. The 450 mm push by Intel, Samsung Electronics, TSMC and Toshiba also has an environmental angle, which dovetails with a new ESH push at the International Sematech Manufacturing Initiative (ISMI, Austin, Texas).

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