Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... April 29, 2008

TSMC Ramping Aggressive
CPU Process Push
TSMC is "hiring aggressively" to develop a technology platform for CPU production, said CEO Rick Tsai. While conceding that TSMC's process technology has lagged Intel's thus far, Tsai said TSMC expects its processor production to "blossom" starting in 2010. "Before, our process technology was not ready for CPU production. While we may not be as good as Intel yet, our technology is good enough to serve a certain segment of the CPU market," Tsai said.
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 MORE NEWS...

SMIC Reports Lower Q1 Revenues as DRAM Shipments Decline

SUSS MicroTec Licenses Philips Nanoimprint Technology

TSMC Reports Strong Q1 YoY Revenues Increase

Mentor Graphics Aligns With UMC to Validate 65 nm Deck

STMicroelectronics Reports 2008 First Quarter Revenues

MEMC Pasadena Facility Back Online After STF Leak

Ultra Clean Gains New Solar Mandate

MORE >>

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May 20: Can Copper Deposition Break the 32 nm Barrier?
It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this webcast, a panel of industry experts will discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY and Zsolt Tökei of IMEC.
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Peak Water: Aquifers and Rivers are Running Dry. How Three Regions are Coping
Wired magazine reports on water usage in Chandler, Ariz., where Intel has three "colossal" semiconductor manufacturing plants. The fabs are by far the city's biggest consumer of water.

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