WLP Could Transform MOEMS, MEMS
Herwig Kirchberger, EV Group, St. Florian, Austria — Semiconductor International, 4/1/2008

MEMS packaging costs still account for more than 50% of the total cost. Aligned wafer bonding techniques for wafer-level packaging (WLP), however, have the potential to reduce these costs, thanks to a smaller total package, improved performance and shorter time to market. More

Yole Ranks Top 30 MEMS Suppliers
Staff — Semiconductor International, 1/31/2008

Yole Développement (Lyon, France), a market research firm specializing in MEMS, packaging and related markets, released its 2007 ranking of the Top 30 MEMS manufacturers. The market research firm also broke out the fastest-growing MEMS applications, with consumer and medical fluidics markets showing particularly fast growth. More

Strong Sensor, Actuator Market Driven by MEMS Technologies
David Lammers, News Editor — Semiconductor International, 3/27/2008

MEMS technology is driving new applications, making sensors and actuators the fastest growing part of the overall semiconductor industry, according to IC Insights Inc. Overall growth of the chip industry is expected to be healthy over the next five years, with a 12% CAGR driven by improving ASPs. More

MEMS Accelerometers Have Multiple Personalities
Business Wire, 4/10/2008

MEMS accelerometers have hit the limelight in the past year, although most consumers are probably quite unaware that they make the Nintendo Wii's motion-sensing remote control and the Apple iPhone's self-orienting display possible. More

Researchers Building MEMS-Based Computers
Gary Anthes — ComputerWorld, 3/10/2008

In the 19th century, British mathematician Charles Babbage invented the "difference engine," a mechanical computer that had an enormously complex arrangement of levers, ratchets and gears. Now, mechanical computers are back. The research is being funded by the U.S. Defense Advanced Research Projects Agency. More

Purdue Leads Center to Simulate MEMS Systems
US Fed News, 3/7/2008

The National Nuclear Security Administration has awarded a $17M cooperative agreement for a research center at Purdue University's Discovery Park to develop advanced simulations for commercial and defense applications. More

Freescale Establishes 200 mm MEMS Production Line
Business Wire, 1/14/2008

Freescale Semiconductor has established an advanced MEMS 200 mm production line to address growing demand for sensors. The newly added line at Freescale's Oak Hill Fab in Austin, Texas, complements the company's existing 150 mm MEMS capacity in Sendai, Japan. More

Europractice IC Service Expands to MEMS Prototyping
Business Wire, 3/11/2008

Tronics Microsystems SA, a global manufacturer of custom MEMS components, and IMEC, representing Europractice IC Service, announced their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. More

SEMI Publishes 8 New Technical Standards
PR Newswire, 2/12/2008

SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. More

Akustica's Microphones Win Laptop Marketshare
Market Wire, 12/18/2007

With more than 2 million of Akustica Inc.'s microphone chips in the hands of PC manufacturers this year, the company's shipment milestone points to a "coming of age" and acceptance of its unique CMOS MEMS technology. More