Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... April 23, 2008

Air Gaps: Unlikely Becoming
More Likely?

The upcoming International Interconnect Technology Conference (IITC) will feature papers on the use of air gaps as a low-k dielectric. Air gaps seem to be emerging out of the pure research phase, becoming possible, even likely, to one day be used in production devices. Toshiba researchers, as well as a team from STMicroelectronics and CEA-Leti, will present at the IITC meeting on using sacrificial materials to create air gap-enhanced interconnects.
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