Perspectives From the Leading Edge: COSMOS
Most practitioners are now in agreement that the applications space for 3-D will likely see commercialization in the following order: image sensors, where the second-generation products will be stacked (bonded) with DSPs; some form of memory stacking with TSVs (probably DRAM before flash); memory bonding to processors and other logic chips (to address latency issues in applications like multicore processors); and heterogeneous integration, where stacking will allow for the integration of otherwise incompatible technologies.