Semiconductor International NewsBreak
Semiconductor International NewsBreak
TOP STORY... April 21, 2008

D2I Project Reduces Mask Inspection Time
Japan's government-backed Mask D2I (design, drawing and inspection) project has developed a method to reduce mask inspection times by as much as 40% by learning to discriminate between defects on critical and non-critical patterns. The Mask D2I team sought to reduce review time by significantly simplifying the defect definition process. The project team leader comes from Nuflare Technology, and the technology developed by the D2I project will eventually be transferred to NuFlare, which makes electron-beam mask writers.
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 MORE NEWS...

Hynix to Sharply Cut Capex Spending

N.A. Semiconductor Equipment Industry Posts March B2B of 0.89

AMD Posts Down Q1, Future Cloudy

Orders for Japan Chipmaking Gear Down 35.7% in February

Cymer Announces $100M Stock Repurchase Program

Korean District Court Dismisses FormFactor Infringement Complaint

Novellus Orders CyberOptics Metrology Tools

MORE >>

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At least 400 wafers in an hour!
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FEATURED WEBCAST...

Oerlikon and the Future of Solar
Jeannine Sargent, CEO of Oerlikon Solar, sat down for a videotaped interview with Dan Hutcheson, CEO of market research firm VLSI Research Inc. Sargent described how Oerlikon's turnkey solutions for solar cell production are providing companies with excellent ROI, especially in the subsidized European market. Sargent describes the differences between thin film and amorphous silicon photovoltaic technologies.

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May 20: Can Copper Deposition Break the 32 nm Barrier?
It is uncertain how extendible copper deposition processes will be at the 32 nm node and beyond. In this webcast, a panel of industry experts will discuss possible options and solutions for metallization schemes. Panelists include: Eric Eisenbraun of the University at Albany-SUNY and Zsolt Tökei of IMEC.
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