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April 16, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
Because of the "now virtually certain" U.S. recession and sharply reduced DRAM spending, Gartner Inc. has downgraded its capital spending forecast for 2008, including an expected 18% decline in packaging and assembly equipment spending. Investment in assembly and test (A&T) equipment is expected to be down 13% from last year, but the good news is that the A&T services market may have hit bottom in 1Q2008, and actually grew 8% year-over-year last quarter. You can read more about Gartner's forecast under the Editor's Picks, and also keep up to date at our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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Soitec Q4 Sales Slump, Sees Further Drop in Q1
Thomson Financial News Super Focus, 4/15/2008
Shares in Soitec SA fell after it announced sharply lower sales for its fourth quarter to March, and said it expects a further drop in the first quarter of the current year. More |
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Rudolph Installation of Inspection Tools at WIN Semiconductors
Business Wire, 4/15/2008
Rudolph Technologies Inc. announced that seven NSXS series inspection tools were recently installed at foundry WIN Semiconductors. Following a competitive evaluation, WIN also acquired multiple licenses for Rudolph's Discover defect analysis/yield management software. More |
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Image Sensor Market Set to Bounce Back
Staff — Semiconductor International, 4/14/2008
IC Insights said that the image sensor market will rebound this year after a downturn in 2007. The market research firm said image sensors will show a 14% CAGR over the next five years to $13.2B in 2012, driven by emerging markets. More |
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Cutting-Edge Microelectronics Manufacturing Center Gets Rolling
Sally Cole Johnson, Contributing Editor — Semiconductor International, 4/14/2008
Binghamton University (Binghamton, N.Y.) officially opened its Center for Advanced Microelectronics Manufacturing (CAMM) at the end of March, in collaboration with Endicott Interconnect Technologies (Endicott, N.Y.) and Cornell University (Ithaca, N.Y.). The center's primary goal is to pioneer microelectronics manufacturing R&D in a roll-to-roll (R2R) format that will result in lightweight, flexible electronic components. More |
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ASAT Holdings Appoints New President
PR Newswire, 4/14/2008
ASAT Holdings Ltd. announced the appointment of Jeffrey R. Osmun to the newly created position of president. More |
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Amkor Names Product Management Group Leader
Business Wire, 4/10/2008
Amkor Technology Inc. announced that Eric Larson will join the company as Executive Vice President of the Product Management Group, effective April 14, 2008. More |
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MEMS Accelerometers Have Multiple Personalities
Business Wire, 4/10/2008
MEMS accelerometers have hit the limelight in the past year, although most consumers are probably quite unaware that they make the Nintendo Wii's motion-sensing remote control and the Apple iPhone's self-orienting display possible. More |
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Gartner Downgrades 2008 Capex Spending Forecast
David Lammers, News Editor — Semiconductor International, 4/16/2008
Gartner Inc. predicted a 19.8% contraction for 2008 semiconductor capital investments, with the U.S. recession and sharp cutbacks by DRAM vendors causing the reduced spending. Bright spots include an apparent rebound by semiconductor assemblers, driven by continued growth in PC and cell phone IC shipments. More |
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Intel Considering Closing Philippines Test, Assembly Plant
Ann Steffora Mutschler, Senior Editor — Electronic News, 4/7/2008
After 34 years of doing business in the Philippines, Intel officials have notified employees there that the company is exploring multiple options for its manufacturing plant in Cavite, including closing the test and assembly facility. If the facility is closed, it is not clear if there will be an impact on the recently launched Intel/STMicroelec-tronics flash joint venture Numonyx, which has some of its 7000 employees located in the Philippines. More |
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Bonder
The Opto-Bonder Femto, part of the Fineplacer family, can handle various assembly technologies, including power laser/laser bar bonding, flip-chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass, as well as simple die attach.
Finetech, Tempe, Ariz.
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BGA Interposers
BGA interposers were created for converting lead-free BGA device packages for use on boards processed with lower-temperature tin/lead solder profiles. Designed for RoHS-exempt applications, the interposers solve BGA device transition, obsolescence and solderability issues associated with the higher-temperature requirements to process lead-free BGA packages.
Advanced Interconnections Corp., West Warwick, R.I.
More |
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May 6, 2008: IMAPS New England
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May 7-9, 2008: Symposium on Polymers for Microelectronics
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May 12, 2008: 3-D Integration and Packaging
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May 20-21, 2008: MEMS Packaging Course
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