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April 2, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
Good news: SEMI says the global semiconductor materials market expanded 14% in 2007 to $42B, with the packaging sector topping out at $17B (a 9% increase over 2006). Looking forward, thanks in large part to the widespread adoption of advanced packaging technologies, SEMI expects the global semiconductor materials market to grow more than 11% this year.
If you missed out on SI's webcast, "Through-Silicon Vias: Ready for Prime Time?" last week, don't despair. The webcast is available online on demand and Editor-in-Chief Laura Peters wrote a wrap-up of the event, which you can find in the Editor's Picks below. Keep up to date with more advanced packaging news and events at our Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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Semi Materials Post Record Revenues for Fourth Straight Year
Market Wire, 3/31/2008
The global semiconductor materials market grew 14% in 2007 and is forecasted to grow over 11% in 2008, according to the latest materials forecast from SEMI. While the semiconductor industry grew 3% in 2007 to reach the $256B published by the Semiconductor Industry Association (SIA), the global semiconductor materials market grew 14% in 2007 to reach a record $42B. Growth was seen in both the wafer fabrication materials and packaging sectors, with increases of 17% or $25B and 9% or $17B, respectively. More |
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iNEMI Launching Studies of Lead-Free Alloys
Staff — Semiconductor International, 4/2/2008
The International Electronics Manufacturing Initiative (iNEMI, Herndon, Va.) said it is organizing projects related to lead-free alternatives, adoption of boundary scan technology, and solder paste deposition challenges. Jim McElroy, CEO of iNEMI, said the consortium seeks to ease the transition to lead-free alloys as suppliers of ball grid array (BGA) packaging search for alloys that provide acceptable mechanical shock performance. Suppliers are also concerned about the high cost of alloys. More |
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Nordson Names Steven Kew to Lead Dage Holdings
PR Newswire, 3/31/2008
Nordson Corp. announced the appointment of Steven Kew as chief executive of its subsidiary Dage Holdings, effective April 1. Kew replaces retiring Dage Chief Executive Geraint Rees. More |
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Tessera's ITC Action to Resume Following Overturn Ruling
Business Wire, 3/28/2008
Tessera Technologies Inc. announced that the U.S. International Trade Commission (ITC) has issued written notice of its unanimous order denying a stay of the case. The ITC's ruling reverses a Feb. 26, 2008, order by the Administrative Law Judge. The order mandates that proceedings in Tessera's wireless ITC action against Motorola, Freescale, Qualcomm and others shall be reinstated at "the earliest practicable time." More |
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Kingston Technology's 2007 Revenues Climb
Business Wire, 3/25/2008
Kingston Technology Corp.'s total global sales for 2007 reached a record $4.5B, a $800M jump from 2006 revenues. The marked increase was largely the result of its thriving flash memory business, which Kingston entered on a large scale in 2003. More |
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ASAT Holdings Announces Financial Results
PR Newswire, 3/28/2008
ASAT Holdings Ltd. recently announced financial results for the third quarter of fiscal 2008, ended Jan. 31, 2008. Net revenue for the third quarter of fiscal 2008 increased for the third consecutive quarter to $41.8M. This compares with net revenue of $40.2M in the previous quarter. Third quarter net loss improved to $5M, or a net loss of $0.12 per American Depositary Share (ADS), compared with a net loss of $5.2M, or a net loss of $0.13 per ADS in the second quarter. More |
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SEMI Reports 2007 Global Equipment Sales
Market Wire, 3/24/2008
SEMI reported that worldwide sales of semiconductor manufacturing equipment totaled $42.8B in 2007, representing a year-over-year increase of 6%. More |
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3-D ICs Are Cost-Driven, Evolutionary
Laura Peters, Editor-in-Chief — Semiconductor International, 3/31/2008
Despite the somewhat revolutionary nature of 3-D integration at the device level, the technology is really evolutionary according to the panelists on Semiconductor International's latest webcast, "Through-Silicon Vias: Ready for Prime Time?" which aired last week. Phil Garrou, IEEE Fellow and consultant with Microelectronic Consultants of North Carolina (Research Triangle Park, N.C.), mapped out the evolutionary way in which the three components of 3-D ICs, through-silicon vias (TSVs), wafer thinning and wafer bonding, are being implemented. "In image sensors for digital cameras, TSVs are used without chip stacking. In the next generation, the sensors will be stacked with DSPs. Sony is stacking memory on logic in the 90 nm PS3 chip." More
View webcast |
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WLP Could Transform MOEMS, MEMS
Herwig Kirchberger, EV Group, St. Florian, Austria — Semiconductor International, 4/1/2008
True wafer-level packaging (WLP) could dramatically reduce the cost of MOEMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS. More |
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Strong Sensor, Actuator Market Driven By MEMS Technologies
David Lammers, News Editor — Semiconductor International, 3/27/2008
MEMS technology is driving new applications, making sensors and actuators the fastest growing part of the overall semiconductor industry, according to IC Insights Inc. (Scottsdale, Ariz.). Rob Lineback, an IC Insights senior analyst, said the overall market for semiconductors — now a $237.5B industry — is expected to be strong over the five-year period ending in 2012, with an 12% compound annual growth rate (CAGR). More |
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| Online Buyer’s Guide: Your Search Starts and Ends Here |
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Search Semiconductor International’s Online Buyer’s Guide for products, services and vendors, or browse through product categories. It's the comprehensive buyers guide for the global semiconductor manufacturing industry. To see the latest company listings and product information, visit: buyersguide.semiconductor.net
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Bonder
The Opto-Bonder Femto, part of the Fineplacer family, can handle various assembly technologies, including power laser/laser bar bonding, flip-chip and VCSEL bonding, MEMs and MOEMs, sensors and micro-optics, chip on glass, as well as simple die attach.
Finetech, Tempe, Ariz.
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Nano Bonding Material
NanoFoil is a bonding material for use in sputter target bonding, large-area bonding, component mounting and as a thermal interface material. It consists of hundreds of alternating nanoscale layers of aluminum and nickel.
Reactive NanoTechnologies Inc., Hunt Valley, Md.
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May 5-7, 2008: SEMICON Singapore
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June 2-4, 2008: IEEE 2008 International Interconnect Technology Conference
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