Lots of news lately about the leading chipmakers and their 45 nm designs. As device scaling forges ahead, also gaining momentum is vertical scaling, and our March issue is full of the latest information on through-silicon vias and 3-D integration. As part of that coverage, we presented a live webcast this week on TSVs, which is now available on demand. Find many of these items highlighted below, but don't forget to check in regularly for more updates at our Wafer Processing Technology Channel:

Aaron Hand, Executive Editor, Electronic Media
ahand@reedbusiness.com

Intel Applies 45 nm Process to Server Processors
Business Wire, 3/25/2008

Intel Corp.'s Quad-Core Xeon processor L5400 series takes advantage of Intel's 45 nm manufacturing capabilities and reinvented transistor formula that combine to boost performance and reduce power consumption in data centers. More

TSMC Readies 40 nm Process Technology
Staff — Semiconductor International, 3/24/2008

TSMC said its 40 nm technology will see first production in the second quarter, with a 15% reduction in active power compared with 45 nm transistors. The 40 nm offering includes an embedded DRAM memory offering. More

ATMI, Ovonyx to Develop Phase-Change Materials
PrimeNewswire, 3/24/2008

ATMI Inc. and Ovonyx Inc. announced an agreement to jointly develop chemical vapor deposition (CVD) precursor materials and processes to enable their use in the commercial, high-volume manufacture of phase-change memory products based on Ovonyx's PCM technology. More

IBM Brings Hitachi Into Albany Ecosystem
David Lammers, News Editor — Semiconductor International, 3/11/2008

IBM and Hitachi researchers will work together on metrology challenges arising at the 22 nm node and beyond, said IBM Vice President Bernie Meyerson. The agreement brings the formidable semiconductor research efforts of Hitachi into the IBM-led Albany research ecosystem. More

Axcelis Board Rejects Revised Proposal by Sumitomo
PrimeNewswire, 3/17/2008

Although Sumitomo Heavy Industries Inc. upped its unsolicited offer for Axcelis to $6 per share, the Axcelis board of directors unanimously rejected the revised offer. More

AMD Demos 45 nm Processors at CeBit
Staff — Semiconductor International, 3/4/2008

AMD said it has demonstrated quad-core processors manufactured at 45 nm design rules at the CeBit exhibition in Germany. The company will deliver 45 nm products later this year. More

Freescale Forging Ahead to 45 nm in 2008
David Lammers, News Editor — Semiconductor International, 3/4/2008

Freescale Semiconductor Inc. will begin sampling networking chips using 45 nm design rules by the second half of this year. Chartered Semiconductor Manufacturing will be its main foundry, said Lisa Su, CTO. More

Micron, Nanya Sign MoU for Joint Venture
Business Wire, 3/3/2008

Micron Technology Inc. and Nanya Technology Corp. jointly announced that the two companies signed a memorandum of understanding (MoU) to explore potential technology sharing, joint technology development and development of a new joint venture. A program for joint DRAM development and design will be created and focus on sub-50 nm technologies. More

RHEM, IBM to Collaborate on CMP Technology
Staff — Semiconductor International, 2/27/2008

Rohm and Haas Electronic Materials, CMP Technologies, a supplier of polishing pads and slurries for chemical mechanical planarization (CMP), announced that it has signed a joint development agreement with IBM. The joint collaboration will focus on CMP process development for the integration of copper and low-k dielectrics at the 32 and 22 nm nodes. More