Reference Metrology Standards: The Looming Nanotech Crisis
Alexander E. Braun, Senior Editor — Semiconductor International, 3/12/2008

As nanotechnology becomes prevalent and lithography workarounds like double patterning maneuver into the mainstream, for crucial measurements to continue providing reliable results instrument calibration — reference metrology — acquires unprecedented importance. A recurring theme in reference metrology and the standards needed is the requirement to address sample-to-sample bias variation and that bias' dependence on secondary characteristics. This means throughput and accuracy trade-offs in reference metrology. Reference metrology is still perceived as referring to a range of tools that, although they provide greater accuracy, are not used for inline metrology because of throughput and speed requirements. More

Litho a Major Metrology Challenge
Alexander E. Braun, Senior Editor — Semiconductor International, 3/19/2008

According to the International Technolog Roadmap for Semiconductors (ITRS), lithography will be one of metrology's biggest hurdles, mostly in the area of advanced patterning; three different methods are currently under development to get around straightforward lithographic capabilities. These are double exposure, double patterning and spacer patterning. Because these three methods require different processing, they have different metrology needs. More

AFM-Based 'Etch-a-Sketch' Draws Nanoscale Features
Alexander E. Braun, Senior Editor — Semiconductor International, 3/20/2008

Using an atomic force microscope (AFM), researchers at the University of Pittsburgh have devised a way to draw, erase and rewrite — much in the way of the venerable but still popular Etch-a-Sketch toy — conductive <4 nm lines and 2-nm-diameter dots. The AFM draws the lines on an insulating layer, a 1.2 nm layer of lanthanum aluminum oxide on a strontium titanium oxide. More

SEMI Reports 2007 Global Equipment Sales
Market Wire, 3/24/2008

SEMI reported that worldwide sales of semiconductor manufacturing equipment totaled $42.8B in 2007, representing a year-over-year increase of 6%. "Supported by the momentum of the 300 mm ramp and intensive memory investments, the global semiconductor equipment industry experienced its second best year ever," said Stanley T. Myers, president and CEO of SEMI. "Of note are the Taiwan and China regions where Taiwan has surpassed Japan and the China new equipment market is approaching the size of Europe's new equipment market." More

IBM Brings Hitachi Into Albany Ecosystem
David Lammers, News Editor — Semiconductor International, 3/11/2008

IBM and Hitachi Ltd. (Tokyo) will cooperate on metrology research and other semiconductor-related challenges, partly to aid the equipment development efforts of Hitachi High Technologies America Inc. (Dallas). Hitachi will join the "ecosystem" that IBM is establishing at the Albany, N.Y.-based IBM Center for Semiconductor Research at the College of Nanoscience and Engineering at the University of Albany. Both companies will work to understand the basic physics needed to produce leading-edge devices, including metrology challenges required for characterizing 22 nm silicon. More

SRC: Nanostructures Require Monitoring at Molecular, Atomic Levels
Alexander E. Braun, Senior Editor — Semiconductor International, 3/13/2008

The full development of nanotechnology requires the ability to cope with things like quantum effects, requiring unprecedented advances in metrology. Dan Herr, director of nanomanufacturing sciences for the Semiconductor Research Corp. (SRC) stated that a concerted effort is needed to determine what and where the metrology gaps are and how they can be closed to meet nanotech's needs. The SRC believes that with some of the emerging devices, it may become necessary to look at coupled nanoscale phenomena, such as spin and charge or orbital reorientation. More

Applied Materials: Patterning Requires Innovative Metrology
Alexander E. Braun, Senior Editor — Semiconductor International, 2/28/2008

Applied Materials (Santa Clara, Calif.) recently held its 12th Annual Technology Forum on "Reality Takes Shape: Patterning at 32 nm," which covered several subjects, including the challenges faced by metrology. Hans Stork, group vice president and CTO of Applied's Silicon Systems Group, noted that metrology's chief challenge lies in increasingly smaller feature sizes, whether produced by double patterning or not. Because these features are below the wavelength of light, they cannot be made visible, requiring electron-beam tools and other indirect methods to see them, resulting in more complicated tooling, machinery and algorithms. More

Agilent to Debut Manufacturing Test Products at APEX Conference
EMSNOW, 3/25/2008

Agilent Technologies will demonstrate its latest manufacturing test solutions at the 2008 APEX Conference and Exhibition in Las Vegas, held April 1-3. Among the products showcased will be new powered vectorless test capabilities for in-circuit test; flexible and cost-effective automated optical inspection platform; the industry's most accurate solder paste inspection system; and 3-D X-ray inspection at inline speeds. More

SPIE: Metrology Must Provide More Accuracy
Alexander E. Braun, Senior Editor — Semiconductor International, 2/27/2008

At the recent SPIE Advanced Lithography Conference, a significant shift in the importance of accuracy vs. precision became apparent in the metrology area. While precision's importance is obvious, the focus on accuracy is becoming sharper — not just for repeatable measurements, but for calibration to standards and National Institute of Standards and Technology (NIST) traceability. Approximately half of the budget for Sematech's (Austin, Texas) metrology group is dedicated to accuracy — not just to metrology or precision. More

Nikon, JEOL Introduce Bench SEM
Test and Measurement World, 3/19/2008

Nikon Instruments and JEOL have collaborated on the NeoScope, a new bench SEM that the companies say fill the optical microscopist's need for advanced imaging capability that is affordable and easy to use. The companies expect the NeoScope will help accelerate research in several fields, including failure analysis of manufacturing materials. The tool offers 10× to 20,000× magnification without the need for a lens change, operates in both low- and high-vacuum modes, and has three settings for accelerating voltage (15, 10 and 5 kV). More

3-D AFM

Test Measurement Unit

The ITC59200 is a test measurement unit designed to determine safe operating area (SOA). Die attach testing is performed to detect voids under the die and other types of device construction flaws that could affect the lifetime and SOA of the device. Integrated Technology Corp., Tempe, Ariz.
More

Macro Defect Inspection Module

April 2-3, 2008: SEMI Executive Event in Israel

April 8, 2008: Nanoelectronics, Nanofabrication and Nanometrology

April 14-17, 2008: International Conference on Compound Semiconductor Manufacturing Technology