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February 6, 2008 |
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IN THIS EDITION |
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NEWS |
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EDITOR'S PICKS |
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PRODUCTS |
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UPCOMING EVENTS |
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Dear Subscriber,
If you haven't had a chance to read Steve Cho's (Surfect Technologies) article about direct-energy plating (DEP) as a new electrodeposition process for interconnects in the February issue of SI, be sure to check it out. It delves into how DEP can address the limitations of traditional plating. You can read it here (under Editor's Picks), along with the latest packaging news. For more news and events, visit our Semiconductor Packaging Technology Channel:
www.semiconductor.net/packaging
Sally Cole Johnson, Contributing Editor
scolejohnson@mac.com |
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| Thru-Silicon-Via (TSV) Foundry Services |
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ON Semiconductor Expands With Packaging Joint Venture
SI China Staff — Semiconductor International, 2/5/2008
ON Semiconductor Corp. (Phoenix) announced that it plans to move all packaging of small outline surface-mount (SOSM) products from Malaysia to Leshan-Phoenix Semiconductor Co. Ltd. (Sichuan, China) in 2008, increasing the Leshan facility's production capacity by 15%. More |
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Harmotec Non-Contact Pick-Up Tool Handles Thin Wafers
Kenji Tsuda, Asia Contributing Editor — Semiconductor International, 2/6/2008
Thinner wafers are required for system-in-a-package (SiP) and multi-chip package (MCP) solutions to cram multiple chips in a thin form factor package. However, as wafer diameters increase, thinned wafers break more easily. Harmotec Corp. (Tokyo) has developed non-contact wafer pickup tools for very thin (20 µm) 300 mm wafers. More |
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New Leadframe-Based Package Integrates QFN, TQFP Technologies
Sally Cole Johnson, Contributing Editor — Semiconductor International, 2/6/2008
Amkor (Chandler, Ariz.) recently debuted "FusionQuad," a leadframe-based plastic packaging technology platform that fuses quad flat pack no leads (QFN) and thin quad flat pack (TQFP) technologies. Interestingly, this approach eliminates the historical pin count barrier of peripheral leaded configurations and can double the number of external I/Os of classic leadframe packaging to nearly 400 unique pins — while also delivering a 50% reduction in package size for a given lead count. More |
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Yole Ranks Top 30 MEMS Suppliers
Staff — Semiconductor International, 1/31/2008
Yole Développement, (Lyon, France), a market research firm specializing in MEMS, packaging and related markets, released its 2007 ranking of the top 30 MEMS manufacturers. The market research firm also broke out the fastest-growing MEMS applications, with consumer and medical fluidics markets showing particularly fast growth. More |
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ASE Reports Financial Results for 2007
PR Newswire, 1/31/2008
Advanced Semiconductor Engineering Inc., an independent provider of IC packaging and testing services, reported unaudited net revenues of NT$29M for the fourth quarter of 2007, up 28% year-over-year and up 4% sequentially. More |
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STATS ChipPAC Reports Full Year Net Income at Record High
Market Wire, 1/30/2008
STATS ChipPAC Ltd., an independent semiconductor test and advanced packaging service provider, recently announced results for the fourth quarter and full year 2007. Tan Lay Koon, president and CEO of STATS ChipPAC, said, "We delivered a strong fourth quarter with record quarterly net income of $41.3M, bringing the 2007 full-year net income to a record high of $93.7M." More |
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Samsung Ventures Makes Packaging Investment in Micro Components
Business Wire, 1/28/2008
Micro Components Ltd., an Israel-based developer of semiconductor packaging technologies, announced that Samsung Ventures Investment Corp. has made a multi-million dollar strategic investment in the company as part of its current financing round. This is the first investment that Samsung Ventures has made in an Israeli technology company. More |
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Tessera to Acquire FotoNation
Business Wire, 1/31/2008
Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry, has entered into a definitive agreement to acquire FotoNation, a provider of embedded imaging solutions for digital still camera and mobile phone applications. More |
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Asymtek Promotes Van de Vijver to GM of Europe
Business Wire, 2/5/2008
Asymtek announced that Michel van de Vijver has been promoted to the position of general manager of Asymtek, Europe. More |
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Hauppauge Chip Inspector Firm Shuts, Lays Off 40
Pete Weiss — Long Island Business News, 2/1/2008
RVSI Inspection of Hauppauge, N.Y., has shut its doors, eliminating 40 manufacturing, engineering and administrative jobs, in the wake of an acquisition by industry rival Rudolph Technologies Inc. of Flanders, N.J. More |
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| Highlights of the 2007 ITRS On Demand Webcast |
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Direct-Energy Plating: A New Electrodeposition Process for Interconnects
Steve T. Cho, Surfect Technologies, Tempe, Ariz. — Semiconductor International, 2/1/2008
As the life cycle for electronic goods continues to shorten because of the escalating demand for new and leading-edge products, the semiconductor industry is faced with growing calls for innovation. In particular, the pressure is on the packaging industry for smaller form factors, higher performance and lower cost. More |
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Roadmap Dictated by Flash, More Than Moore
Laura Peters, Lead Technical Editor — Semiconductor International, 1/25/2008
The 2007 edition of the International Technology Roadmap for Semiconductors (ITRS) projects the technology targets needed to continue to produce semiconductor devices cost-effectively through the year 2022. A significant new focus is the emphasis on More than Moore, the integration of various types of devices, as is deemed cost-effective, either on the same chip or in the same package. More |
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Researchers Develop Forward-Looking Polymer With Immediate Applications
Sally Cole Johnson, Contributing Editor — Semiconductor International, 2/4/2008
Responding to the industry’s call for new advanced packaging and interconnect materials to support emerging flip-chip and optical interconnect technologies, Rensselaer Polytechnic Institute (RPI, Troy, N.Y.) researchers teamed up with Polyset Co. (Mechanicville, N.Y.) to develop a polymer that should help solve redistribution layer challenges and ease future transitions from conventional lithography processes to next-generation on-chip nanoimprinting. More |
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| 2008 Semiconductor Industry Forecast On Demand Webcast |
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This webcast brings together several key industry analysts to debate the semiconductor industry outlook for 2008 and give us their perspectives on application drivers, geographical influences, changes in the memory market and more.
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Scalable Dispensing Platform
The Spectrum S-920 Series of scalable dispensing platforms adapts to the needs and requirements of high-volume microelectronics manufacturing and PCB assembly, such as flip-chip and underfill. It has technologically advanced and integrated software and hardware control based on Fluidmove XP software with process control features.
Asymtek, Carlsbad, Calif.
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Wafer-Level Vibration Sensor
WaferSense Auto Vibration System (AVS) was designed to monitor three-axis accelerations and equipment vibration to optimize equipment motion and wafer throughput. It is a wireless, wafer-like accelerometer available in 200 or 300 mm format.
CyberOptics Semiconductor, Beaverton, Ore.
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| Is Your Product Among the Best of the Best? |
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Don't miss your chance to be recognized with a 2008 Editors' Choice Best Product Award! Enter your product in the 19th annual awards, judged by Semiconductor International's editors, with winners recognized in SI's July issue, as well as a ceremony at SEMICON West. Entry deadline is March 31, 2008.
Get more information and download the entry form today!
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Feb. 11, 2008: Introduction to IC Packaging & Assembly
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March 9-12, 2008: Burn-in & Test Socket Workshop
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March 11-12, 2008: 3D All Silicon System Module
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