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The latest news and information on MEMS manufacturing, including microelectromechanical systems, RF-MEMS and MOEMS.

  • Yole Ranks Top 30 MEMS Suppliers; Sees Rapid Growth in Consumer, Medical
    Staff - 01/31/2008
    Yole Développement, (Lyon, France), a market research firm specializing in MEMS, packaging and related markets, released its 2007 ranking of the top 30 MEMS manufacturers. The market research firm also broke out the fastest-growing MEMS applications, with consumer and medical fluidics markets showing particularly fast growth. More

  • WLP Could Transform MOEMS, MEMS
    Herwig Kirchberger, EV Group, St. Florian, Austria - 04/01/2008
    True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS. More
  • Strong Sensor, Actuator Market Driven By MEMS Technologies
    David Lammers, News Editor - 03/27/2008
    MEMS technology is driving new applications, making sensors and actuators the fastest growing part of the overall semiconductor industry, according to IC Insights Inc. Overall growth of the chip industry is expected to be healthy over the next five years, with an 12% CAGR driven by improving ASPs. More
  • Semiconductor International's Top 100 for 2007
    Staff - 01/22/2008
    Here are Semiconductor International’s very best of 2007 — the features, news, blogs and webcasts most viewed throughout the year. Key topics for the year were, and continue to be, 32 nm development, high-k/metal gates, nanotechnology, solar cells and 3-D integration, among others. If you happened to miss any, they’re all just a click away. More
  • Applied Microstructures Appoints Aitchison as CEO
    Staff - 01/15/2008
    Applied Microstructures Inc. (San Jose), which sells molecular vapor deposition (MVD) equipment to customers in the MEMS, biomedical and other fields, has appointed Kenneth Aitchison as CEO. More
  • Explosives on a Chip: Copper Used as Fuze
    Staff - 12/27/2007
    Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower the cost of certain military munitions. More
  • SAES Settles MEMS Patent Suit With IMT
    Staff - 12/12/2007
    The SAES Getters Group and Innovative Micro Technology Inc. (IMT) have agreed to dismiss all claims and counterclaims in the lawsuit that SAES Getters brought against IMT in April, deciding instead on a long-term supply agreement for MEMS devices. More
  • IMEC and VUB Build Submicron Chromatograph in Silicon
    Staff - 12/12/2007
    IMEC (Leuven, Belgium) and the Vrije Universiteit Brussel (VUB) have built and demonstrated an on-wafer liquid-phase chromatograph using submicron micromachining. Measurements show a 5-10× increase in speed of analysis and an improved separation capacity compared with state-of-the-art macroscopic chromatographs. More
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  • Blogs
  • Talkback
  • Podcasts

Alexander E. Braun
The Measure of All Things

April 10, 2008
An Estimate of Metrologists
Author James Lipton spent the better part of two decades researching and accumulati...
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David Lammers
Views on News

March 20, 2008
SEMI Austin Forum: Trust Needed to Foster Innovation
That phony veil of dispassion that people often hide behind slipped off at the SEMI A...
More

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Dan Herr, SRC
Meeting Nanotech's Metrology Challenges

Dan Herr is director of Nanomanufacturing Science Research at SRC. An important part of his research focuses on nanotechnology’s demands on metrology, and he discusses his work to determine where metrology technology’s gaps are, and how to fill them.

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Technical Articles

    WLP Could Transform MOEMS, MEMS
Herwig Kirchberger, EV Group, St. Florian, Austria, 04/01/2008
True wafer-level packaging could dramatically reduce the cost of M(O)EMS manufacturing. MOEMS packages require optical transparency at the operating wavelength of the individual sensors and actuators, in addition to the conventional packaging requirements of MEMS....

    Additions to the MEMS Toolkit
Paula Doe, SEMI, San Jose, 06/15/2007
Developments in nanoscale processing provide some new options for the MEMS sector to consider, including diamond on insulator (DOI) wafers ready for sacrificial etching of structures with the hardness and thermal conductivity of diamond, and nanoimprint tools approaching production-level throughputs....

More View all stories


EVENTS

MEMS Packaging Course
May 20-21, 2008
Munich, Germany
6th Annual MEMS Symposium
May 22, 2008
San Jose, Calif.
34th International Conference on Micro- and Nano-Engineering, MNE-2008
Sept. 15-18, 2008
Athens, Greece

» VIEW ALL
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