Semiconductor Packaging

• IMEC, Synopsys to Co-Develop 3-D Stacked ICs

  Staff, March 9, 2010
  IMEC will use Synopsys TCAD tools in a collaboration to address reliability and performance concerns in through-silicon via (TSV) technology.  More

• Gartner Sees ‘Spurt' in Capex Spending

  Staff, March 8, 2010
  Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making the technology transition to DDR3 DRAMs. Capex may slow down slightly later this year before picking up again going into 2011, analyst Jim Walker said.  More

• Embedded Die Technology Gains Support

  Sally Cole Johnson, Contributing Editor, March 3, 2010
  Embedded die technology is heading for volume production and may give fan-in wafer-level packaging a run for its money, predicts Yole Développement analyst Jerôme Baron. "Embedding dies into PCB laminates is another key piece of the widening 3-D packaging toolbox," Baron said.  More

• 3-D Interconnects Shape Future Solutions

  Philip Garrou, Contributing Editor, Microelectronic Consultants of NC, February 16, 2010
  An IEEE meeting in Santa Clara, Calif., attracted several leaders of 3-D IC technology development, who presented a list of challenges to the TSV-creation infrastructure.  More

• Fan-Out Packaging Dispute Resolves in IP Licensing Deal

  Sally Cole Johnson, Contributing Editor, February 3, 2010
  What began as a patent dispute over fan-out packaging technologies has resulted in an IP agreement that will ultimately make it easier for packaging subcontractors to license Epic's ChipsFirst and Freescale's RCP technologies in one step, said James Kohl, Epic's CEO.  More

• Driving Down the Cost of TSVs

  Sally Cole Johnson, Contributing Editor, February 1, 2010
  The race to drive down the cost of through-silicon vias (TSVs) is on, with new cost targets in clear view. Industry efforts are moving TSVs beyond the latest 'marketing hype' to a legitimate optional packaging method.  More

• TI Boosts Spending on Assembly and RFAB

  David Lammers, News Editor, January 27, 2010
  With demand strong for computer power ICs, LED TV backlight controllers and other analog products, Texas Instruments is expanding test and assembly capacity to meet customer delivery agreements. Also, a pilot line at the new 300 mm analog RFAB is up and running, and TI expects full production there by the end of the year.  More

• Allvia Offers New TSV Reliability Data

  Sally Cole Johnson, January 25, 2010
  Allvia is stepping forward with details about its full reliability tests, and the data may help customers decide which products are feasible, said CEO Sergey Savastiouk. To avoid CTE issues, Allvia uses a silicon interposer between two stacked substrates and connects them with TSVs. "Our target is to add passive elements on the substrate," he said.  More

Next ›