• Wafer-Level Packaging in Africa?

  Sally Cole Johnson, Contributing Editor, July 1, 2009
  Yes, Africa. Nemotek Technologie is manufacturing wafer-level optics and packaging in its state-of-the-art facility located in Morocco's Rabat Technopolis Park.  More

• Printable Electronics Hits Display Needs

  Michael P.C. Watts, Impattern Solutions, Austin, Texas, June 24, 2009
  Printable electronics could reduce the cost of making flexible displays of the kind used in the Kindle and other E-books. At the recent SID 2009 conference, researchers discussed the marriage of printable electronics and low-power displays used in emerging portable devices, which must be light, flexible, low-power, and readable in ambient light.  More

• Emerging Technologies Go 'Extreme' at SEMICON West

  SEMI, San Jose, June 18, 2009
  Extreme Electronics is the latest "show-within-a-show" concept at SEMICON West, highlighting the technologies for and commercial opportunities in emerging markets, including MEMS, printed and flexible electronics, solid-state lighting and nanoelectronics.  More

• Komatsu Laser Marks on Silicon Surface

  Kenji Tsuda, Asia Contributing Editor, June 2, 2009
  Komatsu Engineering Corp. said it has developed a laser marker that can better identify silicon-based ICs used in applications where chip identification is important, including automotive, medical and computer equipment. The laser irradiates a small portion of the chip, creating a concave surface that forms a 16×16 dot surface.  More

• Imprint Rides Photonic Crystal Wave

  Michael P.C. Watts, Consultant, Impattern Solutions, April 20, 2009
  Light-emitting diodes (LEDs) may gain efficiencies by using photonic crystals defined by imprint lithography. A range of LED makers are developing photonic-crystal LEDs as a way of improving light extraction and beam shaping. Challenges include that the wafers are not very clean or flat, and tend to have surface nodules several microns in size.  More

• Inlustra Starts Nonpolar GaN Production

  David Lammers, News Editor, April 14, 2009
  Inlustra said it is beginning to deliver nonpolar GaN substrates to customers. Started in 2005 as a spin-out from UC Santa Barbara, the company says it has developed proprietary techniques to significantly reduce the number of defects in nonpolar GaN substrates, resulting in improved LED yields.  More

• Tessera Working WLP, Wafer-Level Optics

  Sally Cole Johnson, Contributing Editor, April 1, 2009
  Demand for wafer-level packaging (WLP) is growing, including packages manufactured at the wafer level but that are larger than the chip itself. Tessera is also focusing on optics, TSVs, and thermal management issues, said Craig Mitchell, a senior vice president at the company.  More

• Smart LEDs Promise Better Lighting, Data Transmission

  Alexander E. Braun, Senior Editor, March 23, 2009
  Researchers at Rensselaer Polytechnic Institute have demonstrated a light-emitting diode (LED) with significantly improved lighting performance and energy efficiency. The polarization-matched LED, developed in collaboration with Samsung Electro-Mechanics, has a radically redesigned polarization-matched active region.  More

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