New products for semiconductor manufacturing, including semiconductor capital equipment, materials, and equipment components and subsystems.
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Ulvac Rolls PECVD for Tandem PV Cells
Staff, June 25, 2009
Ulvac Inc. has developed a PECVD system aimed at tandem junction PV cells. The CIM-1400 system adds a microcrystalline silicon (μc-Si) layer to amorphous silicon (a-Si) thin-film solar cells, boosting cell conversion efficiency. The tool will be incorporated into a turnkey production line for tandem junction thin-film production. More
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SUSS MicroTec, 3M Partner on 3-D Bonds
Phillip Garrou, Consultant, Microelectronics Consultants of North Carolina, Research Triangle Park, N.C., June 22, 2009
SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering 3M's temporary bonding process as part of the new SUSS 300 mm bonder line. More
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Nanoelectronics Edge Into Production
Paula Doe, Contributing Editor, SEMI, San Jose, June 19, 2009Graphene and spin wave transistors are among the technologies that look interesting for next-generation FETs. Near term, nanoelectronics products are entering commercial production. At SEMICON West, nanoelectronics challenges are part of the show's Extreme Electronics series on emerging technologies. More -
Komatsu Laser Marks on Silicon Surface
Kenji Tsuda, Asia Contributing Editor, June 2, 2009
Komatsu Engineering Corp. said it has developed a laser marker that can better identify silicon-based ICs used in applications where chip identification is important, including automotive, medical and computer equipment. The laser irradiates a small portion of the chip, creating a concave surface that forms a 16×16 dot surface. More
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Confluense Readies CMP Pad Surface Manager
Staff, May 28, 2009Confluense LLC (Allentown, Pa.) said its pad conditioning system, called Pad Surface Manager, cleans the pad immediately after it contacts the wafer, removing spent slurry, pad debris and byproducts. The company says its system reduces waste while improving yields. More -
Emtec Microscope Tilts Light Source
Kenji Tsuda, Asia Contributing Editor, May 12, 2009
Japan-based Emtec Co. Ltd. has developed an optical microscope that uses a slightly tilted light source to observe transparent surfaces and other objects that are difficult to see with a conventional microscope. More
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Dual-Track Sokudo Duo Boosts Throughput
Staff, April 21, 2009
Sokudo announced a dual-track system, the Sokudo Duo, aimed at boosting throughput of the coat, develop and bake steps to 250-300 wph. Sokudo said the system can support litho cells performing double patterning with ArF immersion scanners. More
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ACM Research Claims Megasonic Solution
David Lammers, News Editor, March 17, 2009
ACM Research said its Shanghai-based R&D team has developed a megasonic cleaning tool, the Ultra C. A subject of intense research, megasonic cleaning faces challenges if energy levels spike, causing bubbles to collapse and damage the wafer. ACM Research founder David Wang said the company has learned to control energy levels across the entire wafer. More
News from the Web
European IEEE SoC Conference to focus on design costs
Source: www.eetimes.eu
Date: 3 hours 28 seconds ago.Triple-Current-Modulation Delta VBE Thermometry Cancels Ohmic Error Sources
Source: electronicdesign.com
Date: 13 hours 23 minutes 28 seconds ago.Will Q3 Be A Good One? (Mannerisms)
Source: Electronics Weekly
Date: 17 hours 47 minutes 5 seconds ago.Parallel Execution of Visual Studio Team System Unit Tests
Source: www.chiplist.com
Date: 19 hours 5 minutes 36 seconds ago.TSMC Unveils 65nm Multi-Time Programmable Non-Volatile Memory Process
Source: edageek.com
Date: 07-02-2009 16:47:32 GMT
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Technical Articles
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Modular Pumping Station
By Semiconductor International Staff 02/01/09The HiCube turbopumping station has a modular design and offers pumping speed in the 35-685 L/sec range for R&D and leak detection applications. -
Microscopy Series
By Semiconductor International Staff 03/15/08The alpha500 and alpha700 microscopy series was designed for automated confocal Raman imaging and atomic force microscopy (AFM) on large samples. The series combines 3-D chemical imaging and AFM for high-resolution structural imaging in an automated system. A motorized sample stage with a travel range of 150 × 100 mm for the 500 model and 350 × 300 mm for the 700 model allows mu... -
X-Ray Metrology Platform
By Semiconductor International Staff 02/01/08JVX6200i is an X-ray metrology platform based on non-contacting, non-destructive X-ray technology. Fast X-ray reflectance (XRR) makes the system capable of first principle independent thickness, density and roughness measurements. Micro-spot X-ray fluorescence (XRF) provides the smallest spot size available and multi-channel detectors for fast data acquisition.
Events
BrightSpots 3D IC Forum
Dates: 07-24, 2009Location:2009 International Workshop on EUV Lithography
Dates: 07-17, 2009Location: Sheraton Waikiki, HonoluluTopical Workshop on Wire Bonding
Dates: 07-13, 2009Location: San Francisco, Calif.




