• Ulvac Rolls PECVD for Tandem PV Cells

  Staff, June 25, 2009
  Ulvac Inc. has developed a PECVD system aimed at tandem junction PV cells. The CIM-1400 system adds a microcrystalline silicon (μc-Si) layer to amorphous silicon (a-Si) thin-film solar cells, boosting cell conversion efficiency. The tool will be incorporated into a turnkey production line for tandem junction thin-film production.  More

• SUSS MicroTec, 3M Partner on 3-D Bonds

  Phillip Garrou, Consultant, Microelectronics Consultants of North Carolina, Research Triangle Park, N.C., June 22, 2009
  SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering 3M's temporary bonding process as part of the new SUSS 300 mm bonder line.  More

• Nanoelectronics Edge Into Production

  Paula Doe, Contributing Editor, SEMI, San Jose, June 19, 2009
  Graphene and spin wave transistors are among the technologies that look interesting for next-generation FETs. Near term, nanoelectronics products are entering commercial production. At SEMICON West, nanoelectronics challenges are part of the show's Extreme Electronics series on emerging technologies.  More

• Komatsu Laser Marks on Silicon Surface

  Kenji Tsuda, Asia Contributing Editor, June 2, 2009
  Komatsu Engineering Corp. said it has developed a laser marker that can better identify silicon-based ICs used in applications where chip identification is important, including automotive, medical and computer equipment. The laser irradiates a small portion of the chip, creating a concave surface that forms a 16×16 dot surface.  More

• Confluense Readies CMP Pad Surface Manager

  Staff, May 28, 2009
  Confluense LLC (Allentown, Pa.) said its pad conditioning system, called Pad Surface Manager, cleans the pad immediately after it contacts the wafer, removing spent slurry, pad debris and byproducts. The company says its system reduces waste while improving yields.  More

• Emtec Microscope Tilts Light Source

  Kenji Tsuda, Asia Contributing Editor, May 12, 2009
  Japan-based Emtec Co. Ltd. has developed an optical microscope that uses a slightly tilted light source to observe transparent surfaces and other objects that are difficult to see with a conventional microscope.  More

• Dual-Track Sokudo Duo Boosts Throughput

  Staff, April 21, 2009
  Sokudo announced a dual-track system, the Sokudo Duo, aimed at boosting throughput of the coat, develop and bake steps to 250-300 wph. Sokudo said the system can support litho cells performing double patterning with ArF immersion scanners.  More

• ACM Research Claims Megasonic Solution

  David Lammers, News Editor, March 17, 2009
  ACM Research said its Shanghai-based R&D team has developed a megasonic cleaning tool, the Ultra C. A subject of intense research, megasonic cleaning faces challenges if energy levels spike, causing bubbles to collapse and damage the wafer. ACM Research founder David Wang said the company has learned to control energy levels across the entire wafer.  More

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