• Cost a Major Challenge for Advanced Packaging Solutions

  Jan Vardaman, President, TechSearch International, Austin, Texas, July 2, 2009
  Over the past several years, IDMs have seen the price of silicon fabrication fall, while the cost of packaging, assembly and test has steadily been on the rise.  More

• MEMS Markets See Growth Opportunities

  Paula Doe, Contributing Editor, SEMI, San Jose, June 19, 2009
  The MEMS industry continues to do remarkably well compared with the IC industry because it is so highly diversified. While automotive, industrial pressure sensing, and inkjet head markets are struggling, new medical and portable system markets are growing rapidly.  More

• Emerging Technologies Go 'Extreme' at SEMICON West

  SEMI, San Jose, June 18, 2009
  Extreme Electronics is the latest "show-within-a-show" concept at SEMICON West, highlighting the technologies for and commercial opportunities in emerging markets, including MEMS, printed and flexible electronics, solid-state lighting and nanoelectronics.  More

• Tessera Working WLP, Wafer-Level Optics

  Sally Cole Johnson, Contributing Editor, April 1, 2009
  Demand for wafer-level packaging (WLP) is growing, including packages manufactured at the wafer level but that are larger than the chip itself. Tessera is also focusing on optics, TSVs, and thermal management issues, said Craig Mitchell, a senior vice president at the company.  More

• Eclipse PVD Tool Handles Thinned Wafers

  David Lammers, News Editor, February 26, 2009
  Working with an Austrian mechatronics firm, the OEM Group has developed an MRC Eclipse PVD tool capable of handling 125 µm thin wafers. The PVD system uses Bernoulli wand technology to handle wafers thinned for through-silicon vias (TSVs) and other backside metal deposition applications.  More

• Léti and Brewer Science Collaborate on 3-D, MEMS

  Staff, February 23, 2009
  Léti and Brewer Science said they will strengthen their research collaboration on materials used in 3-D and MEMS manufacturing, including temporary bonding adhesives. The R&D groups will work together for three years in a common laboratory focused on ultrathin wafer processing flows for 3-D packaging.  More

• Former Applied Exec Bronson Named CEO of SVTC 

  David Lammers, News Editor, January 13, 2009
  R&D fab services provider SVTC Technologies named Joseph Bronson at its new CEO. Bronson, who earlier worked at Applied Materials as the chief financial officer, will seek to expand the SVTC customer base for its semiconductor, solar and MEMS-related development services. SVTC operates fabs in Austin, Texas, and San Jose.  More

• Global Conditions Dampen Europa

  Laura Peters, Editor-in-Chief, October 13, 2008
  Much of the focus of last week’s SEMICON Europa show was on keeping European companies competitive in the semiconductor, solar, MEMS and related industries. Although the AMD/Abu Dhabi announcement did much to boost this concept, a dark cloud caused by the global economic conditions hung over the show in Stuttgart, Germany.  More

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