The latest information on semiconductor inspection, measurement and test including metrology, microscopy, spectroscopy, spectrometry, and CD measurement.
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Sematech Seeks EUV Mask Tool Funding
David Lammers, News Editor, June 30, 2009
Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, director of lithography at Sematech. The consortium is organizing a meeting at SEMICON West of government, consortia and private industry leaders to develop financial support for the EUV mask infrastructure. More
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Solar Metrology Gets Serious
Paula Doe, Contributing Editor, SEMI, San Jose, June 12, 2009Suppliers of optical inspection systems are improving central data management capabilities and tool uptime. The ramp up of solar cell production volume is spurring development of better inspection and metrology tools. More -
EUV Reduced to an Engineering Problem
Laura Peters, Editor-in-Chief, June 9, 2009
EUV seems to be finally at the stage of "just an engineering problem," though a sufficiently powerful and reliable source has yet to be worked out. ASML's Martin van den Brink said his company plans to introduce a production EUV tool, capable of delivering 60 wph throughput, next year. More
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Focus on Solvable Problems
John Williams, Director of Product Marketing, Semiconductor Solutions, FEI, www.fei.com, June 1, 2009While we are currently experiencing a more severe electronics downturn than anyone would have imagined, during this grave economic crisis, investment in R&D has fortunately continued. Not only can these investments lead to the next breakthrough technology, but they are also providing some much-needed sustenance for the semiconductor equipment industry during these difficult days. More -
Testing Multi-Functional Power Management ICs
Tom Chambers, Teradyne Inc., North Reading, Mass., June 1, 2009Cell phone functionality and battery life drive the PMIC market. New test strategies enable faster silicon debug and a quick release to production. More -
Control Strategy for Wafer-Edge Defects
M.F. Hsu and J.H. Yang, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Hsinchu, Taiwan; E. Yang, H. Chen, M. Ng, M. Li and C. Perry-Sullivan, KLA-Tencor Corp., Milpitas, Calif., June 1, 2009Identifying and resolving systematic process issues on edge die before they migrate to interior die prevents production yield loss and enables faster yield ramp. More -
How CD-SEMs Complement Scatterometry
Alexander E. Braun, Senior Editor, June 1, 2009
Like competing Siamese twins, CD-SEM and scatterometry enable and push each other to higher levels of capabilities and evolving applications. More
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Metrologists: Measure Twice, Process Once
Alexander E. Braun, Senior Editor, May 14, 2009
IBM’s T.C. Chen, Alain Diebold of CNSE, and J. Alexander Liddle of NIST were among the metrology experts who spoke at the 2009 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics. The conference was held this week at the College of Nanoscale Science and Engineering (CNSE) at the University at Albany, N.Y. More
News from the Web
Seeing the invisible: Non-destructive subsurface nanoscale metrology with scanning near-field ultrasound holography
Source: www.smalltimes.com
Date: 07-02-2009 05:00:00 GMTToptica Buys Till Photonics
Source: www.photonics.com
Date: 07-02-2009 00:00:00 GMTFrom microwave microscopy to 110-GHz analysis
Source: Test & Measurement World
Date: 07-01-2009 00:00:00 GMTCarl Zeiss Tests New Product Line in Laboratories
Source: www.azonano.com
Date: 06-29-2009 12:48:35 GMTCarl Zeiss Will Launch a New Product Line for High Resolution Microscopy
Source: www.nanowerk.com
Date: 06-29-2009 11:13:53 GMT
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The Measure of All Things
June 30, 2009
Scatterometry on Steroids
It‘s always pleasant to report on ways that our industry often manages to...
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The Measure of All Things
June 04, 2009
Everybody Dance!
While I can’t really call myself a big fan of Jay Leno, I confess to the...
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The Measure of All Things
May 20, 2009
A Jaunt Through Nanotechnopolis
I’ve just returned from Albany, New York, where I attended the 2009...
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The Measure of All Things
March 09, 2009
EUV Litho Needs Metrology Support
Without doubt, metrology is becoming increasingly more important as the industry...
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The memory makers are already using double patterning below 40 nm half-pitch....
memory maker– 7/1/2009 4:48:28 AM CDT
in response to Sematech Seeks EUV Mask Tool FundingContinued EUV support is very poorly justified. To be frank, from what I have...
not liking what I see– 7/1/2009 1:39:49 AM CDT
in response to Sematech Seeks EUV Mask Tool FundingExcellent choice of topic. Interesting summary of CD metrology status, showing...
Yigal Dafna– 6/30/2009 2:55:45 AM CDT
in response to How CD-SEMs Complement ScatterometryI heard water cooling is necessary for the mirrors, but can pose a vibration...
familiar with EUV– 6/22/2009 8:06:23 AM CDT
in response to EUV Reduced to an Engineering Problem
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Technical Articles
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Focus on Solvable Problems
John Williams, Director of Product Marketing, Semiconductor Solutions, FEI, www.fei.com 06/01/09While we are currently experiencing a more severe electronics downturn than anyone would have imagined, during this grave economic crisis, investment in R&D has fortunately continued. Not only can these investments lead to the next breakthrough technology, but they are also providing some much-needed sustenance for the semiconductor equipment industry during these difficult days. -
Testing Multi-Functional Power Management ICs
Tom Chambers, Teradyne Inc., North Reading, Mass. 06/01/09Cell phone functionality and battery life drive the PMIC market. New test strategies enable faster silicon debug and a quick release to production. -
Control Strategy for Wafer-Edge Defects
M.F. Hsu and J.H. Yang, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Hsinchu, Taiwan; E. Yang, H. Chen, M. Ng, M. Li and C. Perry-Sullivan, KLA-Tencor Corp., Milpitas, Calif. 06/01/09Identifying and resolving systematic process issues on edge die before they migrate to interior die prevents production yield loss and enables faster yield ramp.
Events
BrightSpots 3D IC Forum
Dates: 07-24, 2009Location:2009 International Workshop on EUV Lithography
Dates: 07-17, 2009Location: Sheraton Waikiki, HonoluluTopical Workshop on Wire Bonding
Dates: 07-13, 2009Location: San Francisco, Calif.



