• Automation Cuts Solar Costs, Levels the Playing Field

  Paula Doe, Contributing Editor, SEMI, San Jose, June 12, 2009
  The solar industry needs to cooperate on automation if it expects to bring down PV's cost-per-watt to parity with conventional electricity-generating methods. Currently, the solar industry labors under islands of automation, single automated tools or clusters, and almost as many ways of linking those islands as there are PV manufacturers, experts said.  More

• Chang Takes Back CEO Job at TSMC

  David Lammers, News Editor, June 12, 2009
  TSMC's board of directors named Morris Chang as CEO today, handing back the CEO title to the company's founding chairman. Rick Tsai was named president of a new business development organization charged with spearheading the company's efforts in solar cells and other emerging areas.  More

• SEMI World Fab Forecast Reveals Signs of Increased Investment

  Staff, June 10, 2009
  SEMI said total 2009 fab spending is expected to decline by ~51% this year. However, spending is expected to rebound starting in the second half and continuing into 2010. Nine fabs are expected to launch operations in 2009, according to the latest update of the World Fab Forecast.  More

• iSuppli Sees Q2 Fab Utilization Improving to 60%

  Staff, May 7, 2009
  iSuppli said semiconductor manufacturers will enjoy the first improvement in fab utilization in a year, as 60% of fab capacity is being utilized in the current second quarter. The rate will go up to 75% in the third quarter, predicts iSuppli manufacturing analyst Len Jelinek.  More

• TI Ramps Up New Assembly/Test Facility

  Sally Cole Johnson, Contributing Editor, April 28, 2009
  Texas Instruments’ newest assembly/test facility expands its overall capacity in the Philippines, focusing on WCSP and QFN packaging. The Clark facility is following a relatively recent industry trend — it’s on track to achieve Leadership in Energy and Environmental Design (LEED) certification this year.  More

• Freescale to Close Fabs in Japan and France

  David Lammers, News Editor, April 22, 2009
  Freescale Semiconductor executives said the company will close two 150 mm fabs, in Sendai, Japan, and Toulouse, France. The closure of the East Kilbride, Scotland, fab is expected to be complete soon, leaving Freescale with three 200 mm fabs. With fab utilization at 37%, Freescale will spend only ~$20M per quarter on capital expenditures over the next few quarters.  More

• Asyst Files for Chapter 11 Bankruptcy

  David Lammers, News Editor, April 20, 2009
  Asyst Technologies Inc. announced this morning that it expects to file for Chapter 11 bankruptcy in the United States, and a similar voluntary proceeding under Japan’s corporate reorganization law. Delays in customer projects and payments contributed to an inability to repay key loans. The company said it will seek a buyer while under bankruptcy protection.  More

• IBM Alliance Ready With 28 nm Eval Kits

  David Lammers, News Editor, April 16, 2009
  The IBM-led alliance said the evaluation kits for its 28 nm technology are now available, with 28 nm multi-project-wafer shuttles already underway. The alliance has been promoting its high-k/metal gate offering at the 32/28 nm generation. IBM’s Gary Patton said customers also are encouraged by the capacity expansion plans at GlobalFoundries.  More

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