• Rave Lands Rhazer at Chartered's Fab 7

  Staff, June 9, 2009
  Rave LLC said its Rhazer haze removal technology has been evaluated by Chartered Semiconductor. The Singapore-based foundry has purchased the Rhazer tool to mitigate photomask haze at its 300 mm fab in Singapore.  More

• Novellus Improves Clean Process for Speed Max Gapfill Tool

  Staff, June 9, 2009
  Novellus said it has improved the in situ clean steps for its CVD gapfill platform, reducing particles and contaminants significantly. Dielectric films tend to adhere to the process chamber components during the deposition process, and must be removed on a periodic basis.  More

• Novellus Adapts Resist Strip for 3X Node

  Staff, May 14, 2009
  Novellus Systems said it has developed a photoresist stripping process that meets the challenges of the 3X technology generation. The approach, based on the company’s multi-station sequential processing architecture (MSSP), independently controls the chemistry and temperature at each process station.  More

• Steam-Injected Strip Achieves Maximum Implanted Resist Removal

  David DeKraker, Blake Pasker, Jeffery W. Butterbaugh, Kurt K. Christenson and Thomas J. Wagener, FSI International, Chaska, Minn., May 1, 2009
  Heavily implanted photoresist is especially challenging to strip because of the tough layer of dehydrogenated, amorphous carbon that forms on the surface. An alternative approach that injects steam into the process environment can achieve maximum stripping capability.  More

• Post-RIE BEOL Cleaning Gains Attention

  David Lammers, News Editor, April 8, 2009
  Cleaning leading-edge copper interconnect layers has become a major challenge, particularly as cobalt-based via capping layers are introduced. At the Sematech Surface Preparation and Cleaning Conference (SPCC), researchers from several companies presented new BEOL cleaning techniques that are tolerated by 32 nm copper interconnects and CoWP-based caps.  More

• Carbon Trading and the Semiconductor Industry

  Sebastien Raoux, Transcarbon International Corp., San Francisco, April 1, 2009
  Over the next decade, the market for fluorinated emissions trading is estimated at $4.3B. The largest potential trading revenues are in countries with binding emissions reduction commitments under the Kyoto Protocol. For countries that don't participate in the Kyoto Protocol, emissions reduction credit levels are voluntary and lower.  More

• FSI Adds Steam to Photoresist Clean Step

  David Lammers, News Editor, March 26, 2009
  FSI International has developed an all-wet cleaning process that preserves ultrashallow junctions while cleaning carbonized photoresists. Speaking at the Sematech Surface Preparation and Cleaning Conference, FSI chief technologist Jeff Butterbaugh said the photoresist stripping technique injects steam into a sulfuric peroxide mixture.  More

• Rinse/Dry Steps Get New Look at SPCC

  David Lammers, News Editor, March 26, 2009
  The Sematech Surface Preparation and Cleaning Conference (SPCC) opened with several presentations on how to reduce water, chemical and energy usage during cleaning steps. A study conducted at the University of Arizona, with participation from Samsung Electronics Co., employed on-wafer sensors to monitor residual impurity concentrations during hot rinse and spin dry steps.  More

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