• Cost a Major Challenge for Advanced Packaging Solutions

  Jan Vardaman, President, TechSearch International, Austin, Texas, July 2, 2009
  Over the past several years, IDMs have seen the price of silicon fabrication fall, while the cost of packaging, assembly and test has steadily been on the rise.  More

• Sematech Seeks EUV Mask Tool Funding

  David Lammers, News Editor, June 30, 2009
  Few commercial suppliers are stepping up to develop the EUV mask inspection tools that will be needed for 22 nm EUV patterning, said Bryan Rice, director of lithography at Sematech. The consortium is organizing a meeting at SEMICON West of government, consortia and private industry leaders to develop financial support for the EUV mask infrastructure.  More

• Advanced Imaging Solutions for Shrinking the k1 Gap

  SEMI, San Jose, June 25, 2009
  There's still room for improvement in optical lithography. At SEMICON West, Stephen Renwick of Nikon Precision Inc. will share his perspective on how much more the industry can get out of 193 nm optical litho, and — perhaps more important — what it will take to get there.  More

• SEMICON West Session Focuses on 22 nm Lithography

  SEMI, San Jose, June 25, 2009
  Moderated by Semiconductor International Executive Editor Aaron Hand, the "Lithography Challenges and Solutions" session at the Device Scaling TechXPOT at SEMICON West (located in North Hall at Moscone Center) will feature technologists from across the semiconductor supply chain.  More

• Ulvac Rolls PECVD for Tandem PV Cells

  Staff, June 25, 2009
  Ulvac Inc. has developed a PECVD system aimed at tandem junction PV cells. The CIM-1400 system adds a microcrystalline silicon (μc-Si) layer to amorphous silicon (a-Si) thin-film solar cells, boosting cell conversion efficiency. The tool will be incorporated into a turnkey production line for tandem junction thin-film production.  More

• Printable Electronics Hits Display Needs

  Michael P.C. Watts, Impattern Solutions, Austin, Texas, June 24, 2009
  Printable electronics could reduce the cost of making flexible displays of the kind used in the Kindle and other E-books. At the recent SID 2009 conference, researchers discussed the marriage of printable electronics and low-power displays used in emerging portable devices, which must be light, flexible, low-power, and readable in ambient light.  More

• Applied, DNS Reshuffle Stakes in Sokudo

  David Lammers, News Editor, June 23, 2009
  Applied Materials and Dainippon Screen said they are adjusting ownership in the Sokudo track joint venture established in 2006. Applied will reduce its share of the JV to 19%, making Sokudo a subsidiary of DNS. Sokudo had losses of ~$122M in the fiscal year ending March 31, 2009.  More

• SUSS MicroTec, 3M Partner on 3-D Bonds

  Phillip Garrou, Consultant, Microelectronics Consultants of North Carolina, Research Triangle Park, N.C., June 22, 2009
  SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering 3M's temporary bonding process as part of the new SUSS 300 mm bonder line.  More

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