Philip Garrou
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Perspectives From the Leading EdgeRecent Posts3D Integration Highlights of the 2008 MRS contd.January 8, 2009 | Link This | Email this | Comments (0) Continuing to update recent work from the 2008 MRS in Boston……………..
Craig Keast and his group at Lincoln Labs (LL) have been working on 3D approaches for several years now. Their standard process is SOI and uses W vias done last. The photo below shows a nice close up of the W TSVs in a 3 layer ring oscillator circuit. They have performed DARPA sponsored multiproject runs in 2006, 2007 and 2008 and has published extensively on the performance of actual 2 and 3 layer devices (not just process development). For those interested in the LL process check out the chapter that Jim Burns and he wrote in “Handbook of 3D Integration V2” ( Wiley-VCH 2008 ). An interesting comment he made dur...Read More Recent PostsFisk, Buckner and Pasta on the North EndDecember 31, 2008 | Link This | Email this | Comments (0) Having spent a decade of my life there, I came to know and love Boston as a great East Coast city. I define my Boston decade by two of the great moments in the history of “Red Sox Nation”, since my arrival coincided with Carlton Fisk willing his HR fair in the 1975 World Series and I left town shortly after Billy Buckner let the ground ball scoot through his legs in the 1986 World Series. Aside from baseball, I truly loved the North End where you could discover a new, Italian restaurant every weekend, if you so chose, and believe me I did. So anytime I can find an excuse to go back to Boston, I usually do so, in order to indulge myself with great baseball and fine pasta.
In t...Read More Recent PostsToshiba CIS Camera Module Details & EVG and 3M SettleDecember 22, 2008 | Link This | Email this | Comments (2) Over a year ago we announced that Toshiba was going into mass production of CMOS Image sensors with backside TSV [ PFTLE, “Imaging Chips with TSV” 10/27/2007]. Since then, as you know if you read these blogs, most of the other major CIS players have followed suit.
In September Chipworks, a reverse engineering analysis company , announced that they had found the Toshiba TCM9000MD camera module which contained TSV inside a mobile phone and, working with Yole Development, issued a full reverse engineering report on the technology.
...Read More Recent PostsApplied on 3D, 256 Gb Samsung SSDs and a Semprius / CDT joint development programDecember 17, 2008 | Link This | Email this | Comments (0)
We have previously pointed out [ PFTLEAug 13th 2008 ] that AMAT was now a believer in TSV and 3D integration. Their approach to enabling TSV is to offer etch, dielectric liner, barrier layer and CMP unit operations as well as work with partner Semitool on EDC (electro deposited copper). - "3D Integration stays HOT at Semicon West" ,
In early December Applied revealed its Centura “Silvia” etch system which was designed to manufacture TSV....Read More Recent PostsBest of the Rest at 3D ASIPDecember 4, 2008 | Link This | Email this | Comments (0)
In this last blog covering 3D ASAIP 2008 I will try to cover some of the more interesting information presented at the conference.
Jan Vardaman – TechSearch
Vardaman is sticking by her 2007 very conservative predictions for 3D IC adoption with DRAM / SRAM . She still sees DRAM not happening till post 2010 and NAND not happening till later than that.
Jeff Perkins – Yole
Yole, on the other hand, is standing by their aggressive adoption curve for 3DIC ...Read More Industries: Semiconductor Packaging
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