3D Integration – Sources of Information - Update

In my second blog ( seems like an
eternity ago but it was early last August) I offered up
some information sources for those trying to educate themselves on
the 3D
IC integration literature. Two things were clear way back in
2007: (1) the literature was growing at an exponential rate and (2)
the information was scattered. Now a year later I thought it was
time to update that blog.

Wiley-VCH  Handbook of
3D Integration

Every new technology needs a
compilation of information that everyone in the field can go to and
trust. A group of us got together in 2007 and tried to do that for
3D IC integration. Wiley-VCH (Europe) backed us on this effort, and
I’m proud to say that the two volume text
Handbook of 3D Integration: Technology and Applications of 3D
Integrated Circuits edited by yours truly, Chris Bower and
Peter Ramm  is now published and available on Wileys web page
or Amazon.com . The effort took us the better part of a year and if
I do say so myself came out really well. Wiley-VCH did a great job
on the layout and surprised us by keeping nearly all the color
figures and not converting them to black and white. We tried to
cover all the important topics we could think of, and tried to make
sure the coverage went through the summer of 2007. Of course, like
any compilation of information, one year later it is already dated,
however we sincerely hope it can be used a basic source of
information for many years to come.  

To give you a taste of who
participated, we have chapters by IDMs - IBM, Infineon, Intel,
Micron, NXP, Philips, Qimonda and Toshiba; 3D startups - Tezzaron,
Ziptronix and Zycube; equipment suppliers EVG and Semitool;
Universities - Delft Univ, Eindhoven Univ, Ecole
Polytech-Lausanne, MIT, Nanyang Tech Univ, North Carolina State
Univ, Rensselaer Polytech, TU Chemnitz, U Arkansas and U
Minnesota; and Institutes CEA Leti, Fraunhofer IIS,
Fraunhoffer IZM, IMEC, ITRI, Sematech and SINTEF.

Go on over to
Amazon and take a look !

 3-D Architectures for
Semiconductor Integration and Packaging

The 5th Int Conf on 3-D
Architectures for Semiconductor Integration and Packaging will be
held at the Hyatt SF airport on Nov 17-19^th. Sitaram
Arkalgud of Sematech and I have been working with RTI Int’s
Matt Mecray to put the program together. Here is a “sneak
peak” at the program which will be posted at http://techventure.rti.org/fall2008/
soon.

Keynote talks: Mike
Shapiro –
IBM
                        
 Shekhar Borkar – Intel

                         
Gurtej Sandhu – Micron 
                        
 CS Chen - TSMC

Market Analysis:
Jan Vardaman – TechSearch
                              
Eric Mounier – Yole

Presentations / Panel
discussions: Alcatel, Alchimer, Amkor, Aviza, Brewer, CEA
Leti. EVG, Freescale, IMEC, Lamm, Nexx, Qualcom, R3Logic, Sematech,
Semitool, STS, Suss, Tezzaron, Xilinx, XSiL, Ziptronix, Zycube,

……for the latest
updates on 3D IC technology stay linked to Perspectives from
the Leading Edge
(PFTLE)……………….

Coming up on PFTLE: 
Keepin’ 3D COOL – recent 3D cooling technologies

Besang – An alternate
route to 3D IC s ??