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Metrology Conference Preparations Are Underway
October 20, 2008
The second call for papers has gone out for Frontiers of Characterization and Metrology for Nanoelectronics, a conference that I consider as the top metrology event of its kind.
Held every other year, this time the conference will take place in Albany at the College of Nanoscale Science and Engineering (CNSE) at the University of Albany, New York, from May 11 to 14, 2009. As before, those presenting papers will examine the latest R&D advances in characterization and metrology that are certain to play an important role in helping shape the future—and continuation—of the nanoelectronics revolution. The conference is sponsored by the National Institute of Standards and Technology (NIST); College of Nanoscale Science & Engineering, University at Albany; Semiconductor Equipment and Materials International; the Semiconductor Research Corporation; International SEMATECH Manufacturing Initiative; the National Science Foundation; the American Physical Society; and the American Vacuum Society. Semiconductor International is the sponsoring publication.
The College of Nanoscale Science and Engineering at the University of Albany. (Source: CNSE)
A partial list of the subjects to be covered during the event should be sufficient to whet your appetite for edge-of-technology information, and get a glimpse of why this is such an important event for those of us involved in metrology, whether we practice or cover it: Alternative gate dielectrics; beyond CMOS; breakthroughs in electron microscopy; breakthroughs in lithography; channel engineering (strained silicon, III-Vs); contamination, detection, and Identification; critical analytical techniques; defects; device manufacturing; diagnostics; in-situ, real-time control and monitoring; integrated metrology; interconnects—present and future; lab-on-a-chip; MEMS/NEMS metrology applications; modeling/simulation; nanoelectronics materials and devices; novel measurement methods, breakthroughs; thin-films; ultra-shallow junctions; wafer fab; wafer manufacturing and new substrate materials. There will also be a short course, “High Resolution X-ray Scattering Methods for Nanostructure Characterization and Metrology” presented by Dr. Richard Matyi, of the University. If you need a further inducement to attend, the CNSE folks will host tours of some of their nanotech facilities.
So far, there are confirmed speakers from Dai Nippon Printing, the Chinese Academy of Sciences, the National Institute of Standards and Technology, IBM, IMEC, the Weizman Institute, the Nanoelectronic Institute at Lyons, the College of Nanoscale Science and Engineering, AMD, NASA’s Center for Nanotechnology, Carl Zeiss, Applied Materials, ASML, Cornell University, SEMATECH, and many others. The conference agenda is already posted, and you can get more information by going to its site.
If you are interested in submitting an abstract, you have until December 17, 2008 to do so, and you can get the details at the conference site, as well as get the author information and template for your submission. The technical contact for the conference is David G. Seiler, chief of NIST’s Semiconductor Electronics Division.
Hope to see you there!
Posted by Alexander E. Braun on October 20, 2008 | Comments (0)
