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3D Integration – Sources of Information - Update
August 22, 2008
In my second blog ( seems like an eternity ago but it was early last August) I offered up some information sources for those trying to educate themselves on the 3D IC integration literature. Two things were clear way back in 2007: (1) the literature was growing at an exponential rate and (2) the information was scattered. Now a year later I thought it was time to update that blog.
Wiley-VCH Handbook of 3D Integration
Every new technology needs a compilation of information that everyone in the field can go to and trust. A group of us got together in 2007 and tried to do that for 3D IC integration. Wiley-VCH (Europe) backed us on this effort, and I’m proud to say that the two volume text Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits edited by yours truly, Chris Bower and Peter Ramm is now published and available on Wileys web page or Amazon.com . The effort took us the better part of a year and if I do say so myself came out really well. Wiley-VCH did a great job on the layout and surprised us by keeping nearly all the color figures and not converting them to black and white. We tried to cover all the important topics we could think of, and tried to make sure the coverage went through the summer of 2007. Of course, like any compilation of information, one year later it is already dated, however we sincerely hope it can be used a basic source of information for many years to come.
To give you a taste of who participated, we have chapters by IDMs - IBM, Infineon, Intel, Micron, NXP, Philips, Qimonda and Toshiba; 3D startups - Tezzaron, Ziptronix and Zycube; equipment suppliers EVG and Semitool; Universities - Delft Univ, Eindhoven Univ, Ecole Polytech-Lausanne, MIT, Nanyang Tech Univ, North Carolina State Univ, Rensselaer Polytech, TU Chemnitz, U Arkansas and U Minnesota; and Institutes CEA Leti, Fraunhofer IIS, Fraunhoffer IZM, IMEC, ITRI, Sematech and SINTEF.
Go on over to Amazon and take a look !
3-D Architectures for Semiconductor Integration and Packaging
The 5th Int Conf on 3-D Architectures for Semiconductor Integration and Packaging will be held at the Hyatt SF airport on Nov 17-19th. Sitaram Arkalgud of Sematech and I have been working with RTI Int’s Matt Mecray to put the program together. Here is a "sneak peak" at the program which will be posted at http://techventure.rti.org/fall2008/ soon.
Keynote talks: Mike Shapiro – IBM
Shekhar Borkar – Intel
Gurtej Sandhu – Micron
CS Chen - TSMC
Market Analysis: Jan Vardaman – TechSearch
Eric Mounier – Yole
Presentations / Panel discussions: Alcatel, Alchimer, Amkor, Aviza, Brewer, CEA Leti. EVG, Freescale, IMEC, Lamm, Nexx, Qualcom, R3Logic, Sematech, Semitool, STS, Suss, Tezzaron, Xilinx, XSiL, Ziptronix, Zycube,
……for the latest updates on 3D IC technology stay linked to Perspectives from the Leading Edge (PFTLE)……………….
Coming up on PFTLE:
Keepin’ 3D COOL – recent 3D cooling technologies
Besang – An alternate route to 3D IC s ??
Posted by Philip Garrou on August 22, 2008 | Comments (1)
