Japanese Inventor Develops Flip-Chip Type Semiconductor Device

ALEXANDRIA, Va., Nov. 25 -- Hiroaki Tachibana of Kanagawa, Japan, has developed a method for manufacturing flip-chip type semiconductor device.

According to the abstract released by the U.S. Patent & Trademark Office: "In a method for manufacturing a semiconductor device, either a nickel layer or a nickel-based metal layer is formed on a semiconductor substrate by using a plating process. Then, either the nickel layer or the nickel-based metal layer is washed with one of an aqueous hydrochloric acid solution and an aqueous sulfuric acid solution."

The patent has been assigned to NEC Electronics Corp., Kanagawa.

The inventor was issued U.S. Patent No. 7,452,749 on Nov. 18.

The original application was filed on March 1, 2006, and is available at: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7,452,749.PN.&OS=PN/7,452,749&RS=PN/7,452,749.

For more information about US Fed News federal patent awards please contact: Myron Struck, Managing Editor/US Bureau, US Fed News, Direct: 703/866-4708, Cell: 703/304-1897, Myron@targetednews.com