WIPO: Inventors in Japan Develop Interposer Substrate

GENEVA, Nov. 14 - Hanae Hata and Masato Nakamura, both of Kanagawa, Japan, and Masaki Nakanishi and Nobuhiro Kinoshita, both of Tokyo, have developed an interposer substrate manufacturing method.

According to an abstract posted by the World Intellectual Property Organization, the invention provides a "method for forming a narrow-pitch flip-chip bonding electrode and a wire bonding electrode at the same time so as to reduce cost of a substrate."

The invention carries International Patent Publication No. WO/2008/117736 on Oct. 2.

The patent has been assigned to Renesas Technology Corp., Tokyo.

The original patent was filed in Japan under application No. PCT/JP2008/055215 on March 21. It is available at: http://www.wipo.int/pctdb/en/ia.jsp?ia=JP2008/055215.

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